United States Pressure Sensitive Adhesives Market - Growth, Trends, and Forecast (2019 – 2024)

The United States Pressure Sensitive Adhesives Market is segmented by Technology (Waterborne, Solvent Borne, Hot Melt, and Radiation Cured), Application (Tapes, Label, Graphics, and Other Applications), Resin (Acrylic, Silicone, Elastomer, and Other Resins), and End-user Industry (Packaging, Woodworking and Joinery, Medical, Commercial Graphics, Transportation, Electronics, and Other End-user Industries).

Market Snapshot

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Study Period:

2016-2024

Base Year:

2018

Key Players:

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Market Overview

  • The US pressure sensitive adhesives market is expected to register a CAGR of 5.53% over the forecast period of 2019-2024.
  • One of the major factors driving the growth of the market studied is the increasing demand from the packaging and automotive industries. 
  • The rise in minimum wages of workers is likely to acting as a restraint to the market.
  • Development of bio-based pressure sensitive adhesives is likely to act as an opportunity for the pressure sensitive adhesives market.

Scope of the Report

The United States pressure sensitive adhesives market report includes:

Technology
Waterborne
Solvent Borne
Hot Melt
Radiation Cured
Application
Tapes
Label
Graphics
Other Applications
Resin
Acrylic
Silicone
Elastomer
Other Resins
End-user Industry
Packaging
Woodworking and Joinery
Medical
Commercial Graphics
Transportation
Electronics
Other End-user Industries

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Key Market Trends

Increasing Demand from the Packaging and Automotive Industries

  • Due to their ease of application, instant bonding ability, and versatility in joining a wide range of substrates, pressure sensitive adhesives (PSA) are widely used in the packaging industry.
  • PSA offer superior advantages over commonly used glue sticks in the packaging industry, as they do not require heat during application. The absence of heat eliminates hazards, like burns, and increases working safety. Additionally, PSAs are less intrusive on packaging graphics, providing the required adhesion without damaging the brand image. PSAs provide a clear bond that can be removed cleanly, without damaging the packaging or leaving behind any residue.
  • In the automotive industry, PSAs are widely used, as they offer superior benefits over mechanical fasteners. They help in improving crash efficiency of automotive, as they do not affect the substrate used in assembly. They assist in distributing stress over the entire bonded area and do not allow the concentration of stress.
  • PSAs are also used for the attachment of printed circuit boards to heat sinks in automotive electronics applications.
  • As a result of the aforementioned factors, the demand for PSAs is expected to increase, during the forecast period.
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To understand key trends, Download Sample Report

Acrylic Resin Dominated the Market

  • Acrylics copolymers are known to be one of the most widely-used polymers for manufacturing pressure sensitive adhesives.
  • These copolymers are made from a variety of acrylic monomers. These monomers offer viscoelastic performance characteristics. Moreover, numerous high-performance applications, which demand coating thickness and material properties, use acrylic borne PSA.
  • Solvent-borne thermoplastic acrylic resin has good substrate adhesion, making it well suited for UV coating and metallic and pigmented base coats on substrates of ABS, ABS+PC, PS, PC, and metals.
  • Acrylic resin-borne adhesives are highly used in the automotive sector. They also find applications in the aerospace and marine sectors.
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Competitive Landscape

The United States pressure sensitive adhesives market is fragmented, with the top 10 players accounting for small market share. The major companies include; Henkel AG & Co. KGaA, Arkema (Bostik), HB Fuller, 3M Company, and Avery Dennison, among others.

Major Players

  1. Henkel AG & Co. KGaA
  2. Arkema Group (Bostik SA)
  3. H.B. Fuller Company
  4. Avery Dennison Corporation
  5. 3M

* Complete list of players covered available in the table of contents below

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Table of Contents

  1. 1. INTRODUCTION

    1. 1.1 Study Deliverables

    2. 1.2 Study Assumptions

    3. 1.3 Scope of the Study

  2. 2. RESEARCH METHODOLOGY

  3. 3. EXECUTIVE SUMMARY

  4. 4. MARKET DYNAMICS

    1. 4.1 Drivers

      1. 4.1.1 Increasing Demand from the Packaging and Automotive Industries

      2. 4.1.2 Other Drivers

    2. 4.2 Restraints

      1. 4.2.1 Rise in Minimum Wages of Workers

    3. 4.3 Industry Value-Chain Analysis

    4. 4.4 Porter's Five Forces Analysis

      1. 4.4.1 Bargaining Power of Suppliers

      2. 4.4.2 Bargaining Power of Consumers

      3. 4.4.3 Threat of New Entrants

      4. 4.4.4 Threat of Substitute Products and Services

      5. 4.4.5 Degree of Competition

  5. 5. MARKET SEGMENTATION

    1. 5.1 Technology

      1. 5.1.1 Waterborne

      2. 5.1.2 Solvent Borne

      3. 5.1.3 Hot Melt

      4. 5.1.4 Radiation Cured

    2. 5.2 Application

      1. 5.2.1 Tapes

      2. 5.2.2 Label

      3. 5.2.3 Graphics

      4. 5.2.4 Other Applications

    3. 5.3 Resin

      1. 5.3.1 Acrylic

      2. 5.3.2 Silicone

      3. 5.3.3 Elastomer

      4. 5.3.4 Other Resins

    4. 5.4 End-user Industry

      1. 5.4.1 Packaging

      2. 5.4.2 Woodworking and Joinery

      3. 5.4.3 Medical

      4. 5.4.4 Commercial Graphics

      5. 5.4.5 Transportation

      6. 5.4.6 Electronics

      7. 5.4.7 Other End-user Industries

  6. 6. COMPETITIVE LANDSCAPE

    1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements

    2. 6.2 Market Share Analysis**

    3. 6.3 Strategies Adopted by Leading Players

    4. 6.4 Company Profiles

      1. 6.4.1 3M

      2. 6.4.2 Arkema Group (Bostik SA)

      3. 6.4.3 Ashland Inc.

      4. 6.4.4 Avery Dennison Corporation

      5. 6.4.5 BASF SE

      6. 6.4.6 DowDuPont

      7. 6.4.7 H B Fuller

      8. 6.4.8 Henkel AG & Co. KGaA

      9. 6.4.9 Huntsman International LLC

      10. 6.4.10 Scapa

      11. 6.4.11 Sika AG

    5. *List Not Exhaustive
  7. 7. MARKET OPPORTUNITIES AND FUTURE TRENDS

    1. 7.1 Development of Bio-based Pressure-sensitive Adhesives

**Subject to Availability

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