Tin Solder Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The Global Tin Solder Market Report is Segmented by Type (Solder Wire, Solder Bar, Solder Paste, and Other Types), Alloy Type (Lead-Based Tin Solder and Lead-Free Tin Solder), Application (Electronics, Automotive, and Other Applications), and Geography (Asia-Pacific, North America, Europe, and Middle East and Africa). The Report Offers Market Size and Forecasts for Tin Solder in Revenue (USD) for all the Above Segments.

Tin Solder Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Tin Solder Market Size

Tin Solder Market Summary
Study Period 2019 - 2030
Market Size (2025) USD 5.36 Billion
Market Size (2030) USD 6.43 Billion
CAGR (2025 - 2030) 3.71 %
Fastest Growing Market Asia Pacific
Largest Market Asia Pacific
Market Concentration Low

Major Players

Tin Solder Market Major Players

*Disclaimer: Major Players sorted in no particular order

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Tin Solder Market Analysis

The Tin Solder Market size is estimated at USD 5.36 billion in 2025, and is expected to reach USD 6.43 billion by 2030, at a CAGR of 3.71% during the forecast period (2025-2030).

Due to the COVID-19 outbreak, nationwide lockdowns worldwide, disruption in manufacturing activities and supply chains, and production halts negatively impacted the market in 2020. However, the conditions started recovering in 2021, thereby restoring the growth trajectory of the market.

• Over the short term, the increasing demand from the electronics industry and rising automotive production are expected to propel the market's growth.

• On the flip side, the regulatory restrictions on the usage of lead-based tin solder and the availability of substitutes are expected to hinder the market's growth.

• The emergence of nanoparticle-based solder materials and an increase in investments in solar photovoltaic energy are expected to create growth opportunities for the market studied.

• The Asia-Pacific region is expected to dominate the market and is also the fastest-growing region.

Tin Solder Industry Overview

The tin solder market is fragmented in nature. The major players (not in any particular order) include Yunnan Tin Company, AIM Metals & Alloys LP, SHENMAO Technology Inc., Senju Metal Industry Co. Ltd, and Thailand Smelting and Refining Co. Ltd.

Tin Solder Market Leaders

  1. Yunnan Tin Company

  2. AIM Metals & Alloys LP

  3. SHENMAO Technology Inc

  4. Senju Metal Industry Co. Ltd

  5. Thailand Smelting and Refining Co. Ltd

  6. *Disclaimer: Major Players sorted in no particular order
Tin Solder Market Concentration
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Tin Solder Market News

  • June 2024: SHENMAO Technology Inc. launched a new thermal fatigue-resistant solder paste, PF918-P250. This paste can meet high-reliability requirements and offers advanced features and superior performance for electronic products requiring exceptional durability.
  • October 2023: AIM Solder (UK) Ltd acquired William Rowland Limited’s solder products business, encompassing solders and alloys. Through this acquisition, the company would expand its capabilities and enhance customer offerings in the metal industry.
  • September 2023: Stannol GmbH & Co. KG launched its new SP6000 solder paste in Munich. This solder paste has been developed as a standard for use with the alloys TSC305 (Sn96.5Ag3Cu0.5) T4 and TSC105 (Sn98.5Ag1Cu0.5) T4. Compared to conventional solder pastes, it can save more than 85% of CO2 emissions.

Tin Solder Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

  • 4.1 Introduction
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.1.1 The Increasing Demand from Electronics Industry
    • 4.2.1.2 Rising Automotive Production
    • 4.2.2 Restraints
    • 4.2.2.1 Regulatory Restrictions on Lead-based Tin Solder
    • 4.2.2.2 Availability of Substitutes
  • 4.3 Industry Value Chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Buyers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products and Services
    • 4.4.5 Degree of Competition

5. MARKET SEGMENTATION (Market Size in Value)

  • 5.1 Type
    • 5.1.1 Solder Wire
    • 5.1.2 Solder Bar
    • 5.1.3 Solder Paste
    • 5.1.4 Other Types
  • 5.2 Alloy Type
    • 5.2.1 Leas Based Tin Solder
    • 5.2.2 Lead Free Tin Solder
  • 5.3 Application
    • 5.3.1 Electronics
    • 5.3.2 Automotive
    • 5.3.3 Other Applications
  • 5.4 Geography
    • 5.4.1 Asia-Pacific
    • 5.4.1.1 China
    • 5.4.1.2 India
    • 5.4.1.3 Japan
    • 5.4.1.4 South Korea
    • 5.4.1.5 Malaysia
    • 5.4.1.6 Thailand
    • 5.4.1.7 Indonesia
    • 5.4.1.8 Vietnam
    • 5.4.1.9 Rest of Asia-Pacific
    • 5.4.2 North America
    • 5.4.2.1 United States
    • 5.4.2.2 Canada
    • 5.4.2.3 Mexico
    • 5.4.3 Europe
    • 5.4.3.1 Germany
    • 5.4.3.2 United Kingdom
    • 5.4.3.3 Italy
    • 5.4.3.4 France
    • 5.4.3.5 Spain
    • 5.4.3.6 NORDIC countries
    • 5.4.3.7 Turkey
    • 5.4.3.8 Russia
    • 5.4.3.9 Rest of Europe
    • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Argentina
    • 5.4.4.3 Rest of South America
    • 5.4.5 Middle East and Africa
    • 5.4.5.1 Saudi Arabia
    • 5.4.5.2 South Africa
    • 5.4.5.3 Rest of Middle East and Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Mergers, Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Ranking Analysis
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 AIM Metals & Alloys LP
    • 6.4.2 Element Solutions Inc.
    • 6.4.3 Harima Chemicals Group Inc.
    • 6.4.4 Indium Corporation
    • 6.4.5 KOKI Company Ltd
    • 6.4.6 Nihon Genma
    • 6.4.7 Senju Metal Industry Co. Ltd
    • 6.4.8 SHENMAO Technology Inc.
    • 6.4.9 Shenzhen Jufeng Solder Co. Ltd
    • 6.4.10 Stannol Gmbh & Co. KG
    • 6.4.11 Thailand Smelting and Refining Co. Ltd (Thaisarco)
    • 6.4.12 Yunnan Tin Company
  • *List Not Exhaustive

7. MARKET OPPORTUNITIES AND FUTURE TRENDS

  • 7.1 Emergence of Nanoparticle-based Solder Materials
  • 7.2 Rising Investments in Solar Photovoltaic Energy
**Subject to Availability
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Tin Solder Industry Segmentation

Tin solder, an alloy predominantly made of tin, is used to forge lasting electrical and mechanical bonds between metals. Historically, lead was a common additive, but due to rising environmental and health concerns, lead-free alternatives have gained prominence. Currently, tin solder is widely utilized in sectors like electronics manufacturing and the automotive industry.

The tin solder market is segmented by type, alloy type, application, and geography. By type, the market is segmented into solder wire, solder bar, solder paste, and other types. By alloy type, the market is segmented into lead-based tin solder and lead-free tin solder. By application, the market is segmented into electronics, automotive, and other applications. The report also covers the market size and forecasts for the tin solder market in 22 countries across major regions. For each segment, the market sizing and forecasts were made based on value (USD).

Type Solder Wire
Solder Bar
Solder Paste
Other Types
Alloy Type Leas Based Tin Solder
Lead Free Tin Solder
Application Electronics
Automotive
Other Applications
Geography Asia-Pacific China
India
Japan
South Korea
Malaysia
Thailand
Indonesia
Vietnam
Rest of Asia-Pacific
North America United States
Canada
Mexico
Europe Germany
United Kingdom
Italy
France
Spain
NORDIC countries
Turkey
Russia
Rest of Europe
South America Brazil
Argentina
Rest of South America
Middle East and Africa Saudi Arabia
South Africa
Rest of Middle East and Africa
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Tin Solder Market Research FAQs

How big is the Tin Solder Market?

The Tin Solder Market size is expected to reach USD 5.36 billion in 2025 and grow at a CAGR of 3.71% to reach USD 6.43 billion by 2030.

What is the current Tin Solder Market size?

In 2025, the Tin Solder Market size is expected to reach USD 5.36 billion.

Who are the key players in Tin Solder Market?

Yunnan Tin Company, AIM Metals & Alloys LP, SHENMAO Technology Inc, Senju Metal Industry Co. Ltd and Thailand Smelting and Refining Co. Ltd are the major companies operating in the Tin Solder Market.

Which is the fastest growing region in Tin Solder Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Tin Solder Market?

In 2025, the Asia Pacific accounts for the largest market share in Tin Solder Market.

What years does this Tin Solder Market cover, and what was the market size in 2024?

In 2024, the Tin Solder Market size was estimated at USD 5.16 billion. The report covers the Tin Solder Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Tin Solder Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Tin Solder Industry Report

Statistics for the 2025 Tin Solder market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Tin Solder analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.