How big is the Thin Wafer Processing And Dicing Equipment Market?

The Thin Wafer Processing And Dicing Equipment Market size is expected to reach USD 728.39 million in 2024 and grow at a CAGR of 6.35% to reach USD 990.95 million by 2029. Read More

What is the current Thin Wafer Processing And Dicing Equipment Market size?

In 2024, the Thin Wafer Processing And Dicing Equipment Market size is expected to reach USD 728.39 million. Read More

Who are the key players in Thin Wafer Processing And Dicing Equipment Market?

Suzhou Delphi Laser Co. Ltd, SPTS Technologies Limited, Han's Laser Technology Industry Group, ASM Laser Separation International (ALSI) BV and Plasma-Therm LLC are the major companies operating in the Thin Wafer Processing And Dicing Equipment Market. Read More

Which is the fastest growing region in Thin Wafer Processing And Dicing Equipment Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Thin Wafer Processing And Dicing Equipment Market?

In 2024, the Asia Pacific accounts for the largest market share in Thin Wafer Processing And Dicing Equipment Market. Read More

What years does this Thin Wafer Processing And Dicing Equipment Market cover, and what was the market size in 2023?

In 2023, the Thin Wafer Processing And Dicing Equipment Market size was estimated at USD 682.14 million. The report covers the Thin Wafer Processing And Dicing Equipment Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Thin Wafer Processing And Dicing Equipment Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Thin Wafer Processing And Dicing Equipment Market Share

Statistics for the 2023 & 2024 Thin Wafer Processing And Dicing Equipment market share, created by Mordor Intelligence™ Industry Reports. Thin Wafer Processing And Dicing Equipment share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Market Share of Thin Wafer Processing And Dicing Equipment Industry

The market for thin wafer processing and dicing is semi-consolidated and comprises very few major players, such as Disco Corporation, Panasonic Corporation, Nippon, and Pulse Motor Taiwan. The market still faces considerable challenges in the manufacturing processes of thin wafers. The above-mentioned factor has led to a slower entry of new players into the market. Nevertheless, the constant innovations and R&D efforts of market players help maintain a competitive edge. Therefore, competitive rivalry in the market is moderate.

March 2024: Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and back sides of non-patterned wafer surfaces for particles and defects. In addition to the conventional dark-field laser scattering detection of foreign material and defects, the LS9300AD is equipped with a new DIC (Differential Interference Contrast) inspection function that enables the detection of irregular defects, even shallow, low-aspect microscopic defects. LS9300AD has the wafer edge grip method and rotating stage used in conventional products to enable front and backside wafer inspection.
November 2023: Corning Inc. sold its German laser technology business to Suzhou Delphi Laser in China. The agreement involved Suzhou Delphi Laser acquiring the complete stake in the division known as Corning Laser Technologies.