Thin Wafer Processing & Dicing Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

Thin Wafer Processing And Dicing Equipment Market Analysis

The Thin Wafer Processing And Dicing Equipment Market size is estimated at USD 728.39 million in 2024, and is expected to reach USD 990.95 million by 2029, growing at a CAGR of 6.35% during the forecast period (2024-2029).

• The increasing efforts to make electronic packaging highly resourceful due to the enormous demand for electronic components owing to amplified usage have made electronic packaging useful in a myriad of applications. These factors are driving the growth of the semiconductor and IC packaging market.
• One of the major factors expected to boost the demand for thin wafer processing and dicing equipment in the coming years is the growing demand for three-dimensional integrated circuits, which are widely used in miniature semiconductor devices such as memory cards, smartphones, smart cards, and various computing devices.
• Three-dimensional circuits are becoming more popular in multiple space-constrained applications, such as portable consumer electronics, sensors, MEMS, and industrial products because they improve overall product performance in terms of speed, durability, low power consumption, and lightweight memory.
• Due to the widespread availability of low-cost cloud computing solutions, the expanding use of server and data center systems across various enterprises and industries is likely to fuel demand for logic devices like microprocessors and digital signal processors. In addition, as the number of IoT-enabled linked devices grows, the utilization of microprocessors also increases. Thin wafers are increasingly employed in these devices to enable effective temperature management and enhance performance. Such factors are responsible for the growth of the market.
• Silicon wafers have long been used as a fabrication platform in microelectronics and MEMS. The silicon-on-insulator substrate is a unique variation of the standard silicon wafer. Two silicon wafers are glued together using a bond layer of silicon dioxide with a thickness of about 1-2 μm to make these wafers. One silicon wafer gets flattened down to 10-50 μm in thickness. The application will determine the exact thickness of the coating.
• The cost of building state-of-the-art thin wafer foundries has increased exponentially, which puts pressure on the market. The number of semiconductor manufacturers has consolidated in recent times. Performance boosts are slowing down, making specialized thin wafers increasingly attractive. The design decisions that enable thin wafers to be universal may be sub-optimal for some computing tasks.
• Various developments in semiconductor research further create opportunities for the market. For instance, in April 2023, Rapidus officially joined Imec’s Core Partner Program, marking a significant stride in sustainable collaboration with Imec in advanced semiconductor research. This move reinforced their commitment to long-term collaboration and advancement in the semiconductor domain.

Thin Wafer Processing And Dicing Equipment Market Trends

Increasing Need for Miniaturization of Semiconductors is Expected to Drive the Market

Thin Wafer Processing And Dicing Equipment Industry Segmentation

The need for miniaturization toward small-sized, high-performing, and low-cost device configurations has created the need for thin wafers. Most of these reach below 100 µm or even 50 µm for applications such as memory and power devices. Moreover, wafer dicing is the process of separating the die from a semiconductor wafer after the wafer has been processed.

The thin wafer processing & dicing equipment market is segmented by equipment type (thinning equipment and dicing equipment [blade dicing, laser ablation, stealth dicing, and plasma dicing]), application (memory and logic, MEMS devices, power devices, CMOS image sensors, RFID, and others), wafer thickness (750 µm, 120 µm, and 50 µm), wafer size (less than 4 inches, 5 inches and 6 inches, 8 inches, and 12 inches), and geography (North America, Europe, Asia-Pacific, Latin America, and the Middle East and Africa). The report offers the market sizes and forecasts for all the above segments in value terms (USD).