What is the current Substrate-Like-PCB Market size?

The Substrate-Like-PCB Market is projected to register a CAGR of 12% during the forecast period (2024-2029) Read More

Who are the key players in Substrate-Like-PCB Market?

Kinsus Interconnect Technology Corp., Ibiden Co. Ltd, Compeq Manufacturing Co. Ltd, Daeduck Electronics Co. Ltd and Unimicron Technology Corporation are the major companies operating in the Substrate-Like-PCB Market. Read More

Which is the fastest growing region in Substrate-Like-PCB Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Substrate-Like-PCB Market?

In 2024, the Asia Pacific accounts for the largest market share in Substrate-Like-PCB Market. Read More

What years does this Substrate-Like-PCB Market cover?

The report covers the Substrate-Like-PCB Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Substrate-Like-PCB Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Substrate-Like-PCB Market Share

Statistics for the 2023 & 2024 Substrate-Like-PCB market share, created by Mordor Intelligence™ Industry Reports. Substrate-Like-PCB share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Market Share of Substrate-Like-PCB Industry

The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.

May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.