Semiconductor Packaging News

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• March 2024: Syensqo, previously part of Solvay Group, demonstrated its advanced materials and services across all process needs to the semiconductor manufacturing industry at Semicon China 2024. The company’s portfolio includes a range of solutions that meet existing needs for long-term reliability and efficiency in high-performance semiconductor applications while paving the way for innovative and sustainable technologies.
• January 2024: The Tamil Nadu government announced a ‘Semiconductor and Advanced Electronics Policy’ during the upcoming Global Investors Meet (GIM). According to the Industries Minister, the focus was on developing exclusive policies for semiconductors and advanced electronics, underpinning the strategy to become a semiconductor and advanced electronics hub.

• June 2024 - Texas Instruments (TI) unveiled the 650V three-phase GaN IPM tailored for 250W motor drive applications. This innovation directly tackles the design and performance trade-offs that engineers often encounter in crafting household appliances and HVAC systems. The DRV7308 GaN IPM boasts features, over 99% inverter efficiency, superior acoustic performance, compact design, and cost savings.
• February 2024 - onsemi has unveiled its 7th Generation IGBT-based Intelligent Power Modules, designed to reduce energy consumption in heating and cooling processes. These modules, specifically the SPM 31 Intelligent Power Modules (IPMs), provide heightened efficiency in energy conversion and superior performance, particularly in three-phase inverter drive applications.

• March 2024 - Arizona State University and Deca Technologies, a provider of advanced wafer- and panel-level packaging technology, announced a partnership. The partnership establishes North America's inaugural research and development hub for FOWLP. Named the Center for Advanced Wafer-Level Packaging Applications and Development, this initiative is poised to fuel innovation in the United States. It not only bolsters the nation's semiconductor manufacturing prowess but also spearheads progress in pivotal sectors like AI, ML, automotive electronics, and high-performance computing.
• November 2023 - Samsung Electronics prepared to launch a new advanced 3D chip packaging technology called SAINT (Samsung Advanced Interconnection Technology) to compete with Taiwan Semiconductor Manufacturing Company's (TSMC's) dominance in the market. The SAINT technology consists of three variants, namely SAINT D, SAINT L, and SAINT S, each aimed at improving the performance and integration of memory and processors for high-performance chips, particularly those utilized in AI applications.

• December 2022 - Canon Inc. launched an i-line lithography stepper for 3D advanced packaging, such as those used with chiplets mounted on an interposer. The FPA-5520iV LF2, based on 365nm wavelength light, is optimized for back-end processing and delivers 0.8-micron resolution across a 52 mm by 68 mm single-exposure field. A four-shot mode extends the area to 100 mm by 100 mm.
• November 2022 - EVG (EV Group), a provider of lithography equipment and wafer bonding for the MEMS, nanotechnology, and semiconductor markets, strengthened its optical lithography solutions portfolio with the launch of the next-generation 200-mm version of its EVG 150 automated resist processing system.

• January 2024: SkyWater Technology and DECA Technologies Inc. announced the launch of a major new Department of Defense DOD program to expand FOWLP capabilities for both government and commercial customers. These capabilities are made possible by a five-year Department of Defense contract recently awarded to Osceola County and SkyWater Florida, which is expected to fund the modernization, equipment, and construction of Neovation Center.
• December 2023: The Arizona Commerce Authority (ACA) announced a USD 17.5 million investment in Arizona State University (ASU) to enhance Arizona's advanced semiconductor manufacturing capabilities. This expansion is anticipated to significantly contribute to the growth of Arizona's fan-out wafer-level packaging R&D and workforce training capacities, thus fostering a thriving manufacturing and research ecosystem in the state to facilitate the development of cutting-edge technology.

• October 2023: Samsung introduced its next-generation memory solutions on Memory Tech Day, with the aim of playing a significant role in offering advanced artificial intelligence models for hyperscale applications. The company has unveiled a range of cutting-edge memory solutions, such as the latest Shinebolt HBM3e memory, the LPDDR5X CAMM2 solutions based on LPDDR package modules, and the detachable AutoSSD that can be conveniently used through storage virtualization. This innovative chip has the potential to revolutionize the future PC and laptop DRAM market.
• August 2023: SK Hynix Inc. has sparked competition in the semiconductor technology race with its latest next-generation high-bandwidth memory (HBM). SK Hynix has successfully created the 5th generation DRAM product, known as HBM3E, specifically designed for high-performance artificial intelligence (AI) applications. HBM is a valuable and high-performance chip that improves data processing speed by vertically linking multiple DRAMs, surpassing the capabilities of conventional DRAMs.

• September 2023 - Samsung Electronics recently introduced the Low Power Compression Attached Memory Module (LPCAMM) form factor, marking a significant advancements in the DRAM market for personal computers, laptops, and potentially data centers. This enhanced development, boasting a remarkable speed of 7.5 gigabits-per-second (Gbps), has successfully undergone rigorous system verification on Intel's platform.
• May 2023 - Taiwan Semiconductor Manufacturing Co. (TSMC) announced plans to further expand its investments in Japan and strengthen its collaboration with semiconductor partners in the country. Currently, TSMC is in the process of building its inaugural foundry in Kumamoto Prefecture, located in Southern Japan, in partnership with Sony Group Corp.

• July 2024: Symmetry Electronics, a division of Braemac and a global distributor specializing in wireless, IoT, and Pro AV technologies, announced a strategic distribution partnership with Silex Technology, a renowned name in connectivity solutions. This collaboration, backed by the Exponential Technology Group (XTG), further solidified Symmetry's standing as a premier global provider of electronic components and associated services.
• June 2024: TVS Electronics Limited, a key player in electronics manufacturing, introduced its Electronics Manufacturing Services (EMS) at its facility in Tumakuru, Karnataka, near Bengaluru. TVS Electronics offers a comprehensive range of electronic solutions, spanning design, manufacturing, sales, services, warranties, and end-of-life services.

September 2022 - Samsung launched Galaxy Tab Active4 Pro Tablet for industrial use. The tablet is embedded with Snapdragon 778G processor from Qualcomm, with a processor speed of 2.4 GHz, and Octa Core with Adreno 642L GPU for high performance. There are two memory variables with 64GB and 128G and a large battery capacity of 7600 mAh. One of the exclusive features of this device is it lets field workers it with their gloves on or even when their hands are wet. The device has passed the military-grade certification and is sleek and lightweight.

January 2023 - Xiaodu introduced an Optical Eye Protection Learning Tablet in China. This Z20 Pro Zhixue Edition has a second-generation display with characteristics similar to paper's. Thus staring at them for extended periods won't be painful for the user's eyes. The tablet is equipped with the AI platform Baidu Brain 7.0, which supports AI computing power and algorithms with educational scenarios to help children learn efficiently. There is also an octa-core CPU and fast charging support of 20W with 9000 mAh battery life.

• December 2022 - JTEKT demonstrated a new double-disc horizontal grinder, DXSG320, that can simultaneously grind both sides of silicon wafers to +/- 1 micron from as-sliced condition. The performance of the new grinder represents a significant improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today.
• March 2022 - DISCO Corporation announced the opening of its Haneda R&D Center in Higashikojiya, Ota-ku, Tokyo, with the aim of strengthening R&D and supporting high demand in the semiconductor and electronic components markets in the future.