Market Share of Power Module Packaging Industry
The power module packaging market is semi-consolidated, with the presence of major players such as Fuji Electric Co. Ltd, Infineon Technologies AG, Mitsubishi Electric Corporation (Powerex Inc.), Semikron, and Amkor Technology Inc. These players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.
With the growing consolidation, technological advancement, and geopolitical scenarios, the market studied has been witnessing fluctuation. In addition, with the increasing vertical integration of foundries and IDMs, the intensity of competition in the market studied is expected to continue to rise, considering players’ ability to invest, which results from their revenues.
In a market where the sustainable competitive advantage through innovation is significant, competition will only increase, given the anticipated surge in demand from end-user industries such as automotive.
In such a scenario, the brand identity plays a major role, considering the importance of packaging quality that the end users expect from the player. With the presence of large market incumbents, such as Fuji Electric, Mitsubishi, AMKOR, Onsemi, and Semikron, the market penetration levels are also high.
Power Module Packaging Market Leaders
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Fuji Electric Co. Ltd
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Infineon Technologies AG
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Mitsubishi Electric Corporation (Powerex Inc.)
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Semikron
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Amkor Technology Inc.
*Disclaimer: Major Players sorted in no particular order
