Market Size of Global MEMS Packaging Industry
Study Period | 2019 - 2029 |
Base Year For Estimation | 2023 |
CAGR | 17.80 % |
Fastest Growing Market | Asia Pacific |
Largest Market | North America |
Market Concentration | Medium |
Major Players*Disclaimer: Major Players sorted in no particular order |
MEMS Packaging Market Analysis
The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period (2022- 2027). Owing to the increase in global demand for smart automotive solutions, the need for the MEMS packaging market is expected to go up. The increasing demand for connected devices and consumer electronics is expected to drive the market for sensors. Additionally, the global industrial sensor usage is soaring due to the ever-increasing applications of sensors, driving the demand for MEMs devices.
- MEMS packaging has evolved from packaging MEMS devices to packaging MEMS systems as the application of MEMS devices has expanded significantly. Innovative and efficient packaging technology is becoming increasingly important, as are new packaging materials.
- The recent technological development of CMOS-compatible MEMS manufacturing processes for low-temperature wafer bonding and other single-chip integration are among the driving innovations in the MEMS packaging market. Another emerging trend is the application of bare wafer stacks for low-cost lead-free semiconductor packages. This enables a low-cost, small-pin package for high-volume production.
- The increasing adoption of MEMS is also contributing to new demand in the embedded die packaging market. The technology is not unique to the market, but its high cost and low yields have diversified it into niche applications, but the potential for future development is immense. Advancements in Bluetooth and RF modules and the rise of WiFi-6 will likely accelerate investment in this technology further.
- The growing adoption of MEMS devices is also encouraging the MEMS packaging vendors to develop innovative packaging techniques further to enhance these devices' efficiency and operational performances. For instance, in 2021, T-SMART, a leading semiconductor manufacturing company, announced that it is working towards a new MEMS packaging technology based on Heterogeneous Integration for the thermopile sensor.
- Furthermore, according to IEEE, MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the need for many devices to be in contact with and protected from the environment simultaneously. In addition, there are also challenges within MEMS packaging, such as die handling, die attachment, interfacial tension, and outgassing. These new MEMS packaging challenges require urgent R&D efforts.
- The usage of MEMS in the chip industry has witnessed immense growth as technology companies around the world accelerated innovation in the fight against the COVID-19 pandemic. The need for tiny devices drives advances in electronics, ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2. However, the pandemic has changed the perception of the global supply chain in manufacturing, where more localized value chains and regionalization have come into the picture.
MEMS Packaging Industry Segmentation
MEMS packaging refers to a set of methods and packaging techniques used to enclose MEMS devices to protect them from the external environment. As different types of MEMS sensors offered have various applications, they are used across multiple industries such as automotive, mobile phones, consumer electronics, healthcare, etc. the packaging is designed to meet the requirements of specific industries.
The study covers the latest trends in MEMS packaging types and technologies and their emerging applications across various end-user industries. The study also covers the impact assessment of COVID-19 on the MEMS packaging market.
By Sensor Type | |
Inertial Sensors | |
Optical Sensors | |
Environmental Sensors | |
Ultrasonic Sensors | |
RF MEMS | |
Others |
By End User | |
Automotive | |
Mobile Phones | |
Consumer Electronics | |
Medical Systems | |
Industrial | |
Others |
By Geography | |
North America | |
Europe | |
Asia Pacific | |
Rest of the World |
Global MEMS Packaging Market Size Summary
The MEMS packaging market is experiencing significant growth, driven by the increasing demand for smart automotive solutions and the proliferation of connected devices and consumer electronics. As MEMS devices are integrated into a wide range of applications, from smartphones to industrial sensors, the need for advanced packaging solutions has become paramount. The market is witnessing a shift from traditional MEMS device packaging to more complex MEMS system packaging, necessitating innovative and efficient packaging technologies and materials. Technological advancements, such as CMOS-compatible MEMS manufacturing processes and bare wafer stacks, are facilitating low-cost, high-volume production, further propelling market growth. The rise of Bluetooth, RF modules, and WiFi-6 is expected to accelerate investments in MEMS technology, enhancing its adoption across various sectors.
The North American region holds a significant share of the MEMS packaging market, supported by its robust electronics industry, high R&D capabilities, and the presence of major semiconductor and tech companies. The region's early adoption of advanced automotive technologies and IoT solutions has bolstered the demand for MEMS devices, particularly in automotive applications like ADAS and autonomous vehicles. The smartphone and consumer electronics sectors also contribute to the market's expansion, with increasing smartphone penetration and the integration of MEMS sensors in devices driving demand for packaging services. Despite the capital-intensive nature of the industry, key players are focusing on diverse product portfolios and R&D investments to maintain a competitive edge. The market's growth is further supported by government initiatives to strengthen the local semiconductor industry, creating a favorable environment for MEMS packaging advancements.
Global MEMS Packaging Market Size - Table of Contents
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1. MARKET INSIGHTS
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1.1 Market Overview
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1.2 Industry Attractiveness - Porter's Five Force Analysis
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1.2.1 Bargaining Power of Suppliers
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1.2.2 Bargaining Power of Buyers
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1.2.3 Threat of New Entrants
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1.2.4 Threat of Substitute Products
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1.2.5 Intensity of Competitive Rivalry
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1.3 Technology Snapshot
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1.4 Assessment of the Impact of COVID-19 on the Market
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2. MARKET SEGMENTATION
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2.1 By Sensor Type
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2.1.1 Inertial Sensors
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2.1.2 Optical Sensors
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2.1.3 Environmental Sensors
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2.1.4 Ultrasonic Sensors
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2.1.5 RF MEMS
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2.1.6 Others
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2.2 By End User
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2.2.1 Automotive
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2.2.2 Mobile Phones
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2.2.3 Consumer Electronics
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2.2.4 Medical Systems
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2.2.5 Industrial
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2.2.6 Others
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2.3 By Geography
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2.3.1 North America
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2.3.2 Europe
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2.3.3 Asia Pacific
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2.3.4 Rest of the World
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Global MEMS Packaging Market Size FAQs
What is the current Global MEMS Packaging Market size?
The Global MEMS Packaging Market is projected to register a CAGR of 17.80% during the forecast period (2024-2029)
Who are the key players in Global MEMS Packaging Market?
ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG and Analog Devices, Inc. are the major companies operating in the Global MEMS Packaging Market.