MEMS Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Global MEMS Package Market is Segmented by Sensor Type (Inertial Sensor, Optical Sensor, Environmental Sensor, Ultrasonic Sensor, RF MEMS), End User (Automotive, Mobile Phones, Consumer Electronics, Medical Systems, Industrial), and Geography.

MEMS Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

MEMS Packaging Market Size

MEMS Packaging Market Forecast
Study Period 2019 - 2030
Base Year For Estimation 2024
Forecast Data Period 2025 - 2030
CAGR 17.80 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Medium

Major Players

Global MEMS Packaging Market Major Players

*Disclaimer: Major Players sorted in no particular order

Compare market size and growth of Global MEMS Packaging Market with other markets in Technology, Media and Telecom Industry

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MEMS Packaging Market Analysis

The Global MEMS Packaging Market is expected to register a CAGR of 17.8% during the forecast period.

  • MEMS packaging has evolved from packaging MEMS devices to packaging MEMS systems as the application of MEMS devices has expanded significantly. Innovative and efficient packaging technology is becoming increasingly important, as are new packaging materials.
  • The recent technological development of CMOS-compatible MEMS manufacturing processes for low-temperature wafer bonding and other single-chip integration are among the driving innovations in the MEMS packaging market. Another emerging trend is the application of bare wafer stacks for low-cost lead-free semiconductor packages. This enables a low-cost, small-pin package for high-volume production.
  • The increasing adoption of MEMS is also contributing to new demand in the embedded die packaging market. The technology is not unique to the market, but its high cost and low yields have diversified it into niche applications, but the potential for future development is immense. Advancements in Bluetooth and RF modules and the rise of WiFi-6 will likely accelerate investment in this technology further.
  • The growing adoption of MEMS devices is also encouraging the MEMS packaging vendors to develop innovative packaging techniques further to enhance these devices' efficiency and operational performances. For instance, in 2021, T-SMART, a leading semiconductor manufacturing company, announced that it is working towards a new MEMS packaging technology based on Heterogeneous Integration for the thermopile sensor.
  • Furthermore, according to IEEE, MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the need for many devices to be in contact with and protected from the environment simultaneously. In addition, there are also challenges within MEMS packaging, such as die handling, die attachment, interfacial tension, and outgassing. These new MEMS packaging challenges require urgent R&D efforts.
  • The usage of MEMS in the chip industry has witnessed immense growth as technology companies around the world accelerated innovation in the fight against the COVID-19 pandemic. The need for tiny devices drives advances in electronics, ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2. However, the pandemic has changed the perception of the global supply chain in manufacturing, where more localized value chains and regionalization have come into the picture.

MEMS Packaging Industry Overview

The MEMS packaging market is moderately competitive. As the industry is capital intensive, major vendors in the market are banking on diverse product portfolios and product development to gain an edge. The innovation capabilities of the vendors are highly dependent on their R&D investments. Additionally, the industry's capital-intensive nature poses an entry barrier to new entrants. Some key players operating in the market are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, and Analog Devices, Inc., among others.

  • August 2022 - MEMSIC, a leading MEMS technology solution provider, releases the first MEMS 6-axis inertial sensor (IMU) MIC6100HG. The product integrates a 3-axis accelerometer and a 3-axis gyroscope, which can support motion-sensing interactive systems such as smart remote controls and game controllers with sensitive sensing. Additionally, the MIC6100HG 6-axis IMU sensor has a large FIFO and supports I2C/I3C/SPI communication mode. The LGA package size is 2.5x3x0.83mm, and the data output frequency is 2200Hz.
  • February 2022 - STMicroelectronics introduced its third generation of MEMS sensors. According to the company, the new sensors are designed to enable the next leap in performance and features for smart industries, consumer mobiles, healthcare, and retail sectors. The newly launched LPS22DF and waterproof LPS28DFW barometric pressure sensors, which operate from 1.7µA and have absolute pressure accuracy of 0.5hPa and are packed in one of the smallest footprints (2.0 x 2.0 x 0.74mm).

MEMS Packaging Market Leaders

  1. ChipMos Technologies Inc.

  2. AAC Technologies Holdings Inc.

  3. Bosch Sensortec GmbH

  4. Infineon Technologies AG

  5. Analog Devices, Inc.

  6. *Disclaimer: Major Players sorted in no particular order
MEMS modrately fragmented.JPG
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MEMS Packaging Market News

  • August 2022 - TDK Corporation revealed the compact, rugged AFA pressure transmitter for screw monitoring for various industrial applications. The pressure transmitter uses MEMS technology with robust stainless steel pressure connections. Suitable for measuring pressure in non-freezing media such as fuels, diluted acids, and polluted air.
  • April 2021 - Bosch Sensortec launched a 4-in-1 Environmental MEMS Sensor with AI. The BME688 is an air quality MEMS sensor that combines four sensing features - humidity, gas, temperature, and barometric pressure - with AI capability. Furthermore, The sensor is housed in a compact package, measuring just 3.0 x 3.0 x 0.9 mm cube.

MEMS Packaging Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Force Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Technology Snapshot
  • 4.4 Assessment of the Impact of COVID-19 on the Market

5. MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Smart Automotive Market
    • 5.1.2 Increasing Smart Phone Adoption Rate & Connected Devices
    • 5.1.3 Sensor Usage in Industries
  • 5.2 Market Restraints
    • 5.2.1 Complex Manufacturing Process

6. MARKET SEGMENTATION

  • 6.1 By Sensor Type
    • 6.1.1 Inertial Sensors
    • 6.1.2 Optical Sensors
    • 6.1.3 Environmental Sensors
    • 6.1.4 Ultrasonic Sensors
    • 6.1.5 RF MEMS
    • 6.1.6 Others
  • 6.2 By End User
    • 6.2.1 Automotive
    • 6.2.2 Mobile Phones
    • 6.2.3 Consumer Electronics
    • 6.2.4 Medical Systems
    • 6.2.5 Industrial
    • 6.2.6 Others
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific
    • 6.3.4 Rest of the World

7. COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ChipMos Technologies Inc.
    • 7.1.2 AAC Technologies Holdings Inc.
    • 7.1.3 Bosch Sensortec GmbH
    • 7.1.4 Infineon Technologies AG
    • 7.1.5 Analog Devices, Inc.
    • 7.1.6 Texas Instruments Incorporated.
    • 7.1.7 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.8 MEMSCAP S.A.
    • 7.1.9 Orbotech Ltd.
    • 7.1.10 TDK Corporation
    • 7.1.11 MEMSIC Semiconductor Co., Ltd
    • 7.1.12 STMicroelectronics
  • *List Not Exhaustive

8. INVESTMENT ANALYSIS

9. FUTURE OUTLOOK OF THE MARKET

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MEMS Packaging Industry Segmentation

MEMS packaging refers to a set of methods and packaging techniques used to enclose MEMS devices to protect them from the external environment. As different types of MEMS sensors offered have various applications, they are used across multiple industries such as automotive, mobile phones, consumer electronics, healthcare, etc. the packaging is designed to meet the requirements of specific industries.

 The study covers the latest trends in MEMS packaging types and technologies and their emerging applications across various end-user industries. The study also covers the impact assessment of COVID-19 on the MEMS packaging market.

By Sensor Type Inertial Sensors
Optical Sensors
Environmental Sensors
Ultrasonic Sensors
RF MEMS
Others
By End User Automotive
Mobile Phones
Consumer Electronics
Medical Systems
Industrial
Others
By Geography North America
Europe
Asia Pacific
Rest of the World
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MEMS Packaging Market Research FAQs

What is the current Global MEMS Packaging Market size?

The Global MEMS Packaging Market is projected to register a CAGR of 17.8% during the forecast period (2025-2030)

Who are the key players in Global MEMS Packaging Market?

ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG and Analog Devices, Inc. are the major companies operating in the Global MEMS Packaging Market.

Which is the fastest growing region in Global MEMS Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Global MEMS Packaging Market?

In 2025, the North America accounts for the largest market share in Global MEMS Packaging Market.

What years does this Global MEMS Packaging Market cover?

The report covers the Global MEMS Packaging Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Global MEMS Packaging Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

MEMS Packaging Industry Report

Statistics for the 2025 Global MEMS Packaging market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Global MEMS Packaging analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.