Memory Packaging Market Share

Statistics for the 2023 & 2024 Memory Packaging market share, created by Mordor Intelligence™ Industry Reports. Memory Packaging share report includes a market forecast to 2030 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Memory Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Memory Packaging Industry Overview

The memory packaging market is moderately competitive. With the rising prices of DRAM memory, vendors operating in the memory packaging market are increasingly spending on the development of 3D NAND. According to an article published by SK Hynix Inc., companies can no longer keep up with 3D NAND demand and are required to expand their manufacturing capacity. Also, many of the companies are expanding their manufacturing units in order to meet the growing demand. Overall the market might move towards highly competitive during the forecast period due to all the above factors.

Memory Packaging Market Leaders

  1. Lingsen Precision Industries Ltd.

  2. Hana Micron Inc.

  3. ASE Kaohsiung

  4. Amkor Technology Inc.

  5. Powertech Technology Inc...

  6. *Disclaimer: Major Players sorted in no particular order
Lingsen Precision Industries Ltd., Hana Micron Inc., ASE Kaohsiung, Amkor Technology Inc., Powertech Technology Inc...

Memory Packaging Market Report Snapshots