High Density Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The High-Density Packaging Market is segmented by Packaging Technique (MCM, MCP, SIP, 3D-TSV), by Applications ( Consumer Electronics, Aerospace & Defense, Medical Devices, IT & Telecom, Automotive, Energy and Utility), and Geography.

High Density Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

High Density Packaging Market Size

High Density Packaging Market Size
Study Period 2019 - 2030
Base Year For Estimation 2024
Forecast Data Period 2025 - 2030
CAGR 12.00 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Low

Major Players

High Density Packaging Market Key Players

*Disclaimer: Major Players sorted in no particular order

Compare market size and growth of High Density Packaging Market with other markets in Technology, Media and Telecom Industry

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High Density Packaging Market Analysis

The High Density Packaging Market is expected to register a CAGR of 12% during the forecast period.

  • Consumer electronic devices are readily available in different kinds of high-density package types like MCM, MCP, SIP, 3D - TSV. The high-density packaging market has drawn the greatest attention in the investment community. The change in the consumer preference for the latest technology and constant innovations by major players for electronic devices has generated an immense market demand for the high-density packaging market.
  • Since most populations are shifting more towards connected devices, so an increase in the Internet of Things (IoT) will lead to the growth of high-density packaging. An increase in the demand for consumer wearable goods, smartphones, and home appliances will act as a positive impact on this industry.
  • For Instance, Amkor offers more than 3000 types of packaging solutions inclusive of high-density packaging applications such as automotive, stacked die, MEMS, TSV, and 3D Packaging.
  • The favorable government regulations in developing countries will drive the market in the forecast period. However, high initial investment might hinder the market.

High Density Packaging Industry Overview

The High density packaging market is fragmented due to the presence of major players in the marketlikeToshiba Corporation,Fujitsu Ltd.,Hitachi, Ltd.,IBM Corporation, SPIL, Micro Technology and others, are the key players in the market without any dominating player.

  • Jan2019 -Red Hat stockholders voted to approve the merger with IBM. The transaction is subject to customary closing conditions, including regulatory reviews and is expected to close in the second half of 2019. IBMannounced its intent to acquire all of the outstanding shares of Red Hat, Inc. The combination of Red Hat’s vast portfolio of open-source technologies, innovative cloud development platform and developer community, combined with IBM’s innovative hybrid cloud technology, industry expertise, and commitment to data, trust, and security, will deliver the hybrid cloud capabilities required to address the next chapter of cloud implementations.
  • Jul 2018-Amkor Technology, Inc.an advance provider of outsourcedsemiconductor packaging services, declared that with the partnership ofMentor to release Amkor’s SmartPackagePackage AssemblyDesign Kit, the first in the industry to support Mentor’s High-Density Packaging design method and tools;can now be done in association with Mentor’s software to produce fresh, accelerated and detailed confirmation results of advanced packages required forInternet-of-Things, automotive, and artificial intelligence applications.

High Density Packaging Market Leaders

  1. Toshiba Corporation

  2. IBM Corporation

  3. Fujitsu Ltd.

  4. Hitachi, Ltd.

  5. Mentor - a Siemens Business

  6. *Disclaimer: Major Players sorted in no particular order
 Toshiba Corporation, Fujitsu Ltd., Hitachi, Ltd., IBM Corporation, SPIL, Micro Technology
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High Density Packaging Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Growing Advancements in Consumer Electronic Products
    • 4.3.2 Favourable Government Policies and Regulations in Developing Countries
  • 4.4 Market Restraints
    • 4.4.1 High Initial Investment and Increasing Complexity of IC Designs
  • 4.5 Value Chain / Supply Chain Analysis
  • 4.6 Industry Attractiveness - Porter's Five Force Analysis
    • 4.6.1 Threat of New Entrants
    • 4.6.2 Bargaining Power of Buyers/Consumers
    • 4.6.3 Bargaining Power of Suppliers
    • 4.6.4 Threat of Substitute Products
    • 4.6.5 Intensity of Competitive Rivalry

5. MARKET SEGMENTATION

  • 5.1 By Packaging Technique
    • 5.1.1 MCM
    • 5.1.2 MCP
    • 5.1.3 SIP
    • 5.1.4 3D - TSV
  • 5.2 By Application
    • 5.2.1 Consumer Electronics
    • 5.2.2 Aerospace & Defence
    • 5.2.3 Medical Devices
    • 5.2.4 IT & Telecom
    • 5.2.5 Automotive
    • 5.2.6 Other Applications
  • 5.3 Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East and Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Toshiba Corporation
    • 6.1.2 IBM Corporation
    • 6.1.3 Amkor Technology
    • 6.1.4 Fujitsu Ltd.
    • 6.1.5 Siliconware Precision Industries
    • 6.1.6 Hitachi, Ltd.
    • 6.1.7 Samsung Group
    • 6.1.8 Micron Technology
    • 6.1.9 STMicroelectronics
    • 6.1.10 NXP Semiconductors N.V.
    • 6.1.11 Mentor - a Siemens Business
  • *List Not Exhaustive

7. INVESTMENT ANALYSIS

8. MARKET OPPORTUNITIES AND FUTURE TRENDS

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High Density Packaging Industry Segmentation

Advanced Packaging is arrangingcomplicated IC chipsvia a variety of high density packaging techniques like MCM, MCP, SIP, and others. The major applications are in consumer electronics devices, IT & Telecom, automotive, medical devices, and others.

By Packaging Technique MCM
MCP
SIP
3D - TSV
By Application Consumer Electronics
Aerospace & Defence
Medical Devices
IT & Telecom
Automotive
Other Applications
Geography North America
Europe
Asia-Pacific
Latin America
Middle East and Africa
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High Density Packaging Market Research FAQs

What is the current High Density Packaging Market size?

The High Density Packaging Market is projected to register a CAGR of 12% during the forecast period (2025-2030)

Who are the key players in High Density Packaging Market?

Toshiba Corporation, IBM Corporation, Fujitsu Ltd., Hitachi, Ltd. and Mentor - a Siemens Business are the major companies operating in the High Density Packaging Market.

Which is the fastest growing region in High Density Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in High Density Packaging Market?

In 2025, the North America accounts for the largest market share in High Density Packaging Market.

What years does this High Density Packaging Market cover?

The report covers the High Density Packaging Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the High Density Packaging Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

High Density Packaging Industry Report

Statistics for the 2025 High Density Packaging market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. High Density Packaging analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.