How big is the High Bandwidth Memory Market?

The High Bandwidth Memory Market size is expected to reach USD 2.52 billion in 2024 and grow at a CAGR of 25.86% to reach USD 7.95 billion by 2029. Read More

What is the current High Bandwidth Memory Market size?

In 2024, the High Bandwidth Memory Market size is expected to reach USD 2.52 billion. Read More

Who are the key players in High Bandwidth Memory Market?

Micron Technology, Inc., Samsung Electronics Co. Ltd., SK Hynix Inc., Intel Corporation and Fujitsu Limited are the major companies operating in the High Bandwidth Memory Market. Read More

Which is the fastest growing region in High Bandwidth Memory Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in High Bandwidth Memory Market?

In 2024, the North America accounts for the largest market share in High Bandwidth Memory Market. Read More

What years does this High Bandwidth Memory Market cover, and what was the market size in 2023?

In 2023, the High Bandwidth Memory Market size was estimated at USD 1.87 billion. The report covers the High Bandwidth Memory Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the High Bandwidth Memory Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

High Bandwidth Memory Market Share

Statistics for the 2023 & 2024 High Bandwidth Memory market share, created by Mordor Intelligence™ Industry Reports. High Bandwidth Memory share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Market Share of High Bandwidth Memory Industry

The high bandwidth memory market is highly fragmented. The market is highly competitive and consists of several major players. This industry's competitive rivalry primarily depends on sustainable competitive advantage through innovation, market penetration, and competitive strategy power. Since the market is capital-intensive, the barriers to exit are also high. Some of the key players in the market are Intel Corporation, Toshiba Corporation, and Fujitsu Ltd.

April 2024 - TSMC signed a Memorandum of Understanding with SK Hynix to develop next-generation HBM (high bandwidth memory) and a next-generation packaging technology. SK Hynix intends to utilize TSMC’s sophisticated logic processes for the foundational component of HBM4, aiming to incorporate more features within the confined space, which is anticipated to boost both the performance and energy efficiency of its memory chips.
March 2024 - Camtek Ltd announced that it received a new order for approximately USD 25 million from a tier-1 HBM manufacturer for the inspection and metrology of high bandwidth memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.