Global Wafer Processing and Assembly Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The Global Wafer Processing and Assembly Equipment Market is segmented by Equipment Type (Chemical Mechanical Polishing (CMP), Etching, Thin Film Deposition(CVD, Sputter), Photoresist Processing, Assembly Equipment (Die Attach, Wire Bonding, Packaging, Inspection, Dicing, Plating and Other), by Product (DRAM, NAND, Foundry/Logic) and Geography.

Global Wafer Processing and Assembly Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Wafer Processing & Assembly Equipment Market Size

CAGR
Study Period 2019 - 2030
Base Year For Estimation 2024
Forecast Data Period 2025 - 2030
CAGR 8.40 %
Fastest Growing Market Asia-Pacific
Largest Market Asia-Pacific
Market Concentration Medium

Major Players

Global Wafer Processing and Assembly Equipment Market Major Players

*Disclaimer: Major Players sorted in no particular order

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Wafer Processing & Assembly Equipment Market Analysis

The Global Wafer Processing and Assembly Equipment Market is expected to register a CAGR of 8.4% during the forecast period.

  • According to the Indian Brand Equity Foundation, In 2022, the Indian appliance and consumer electronics (ACE) sector is predicted to grow at a 9% compound annual growth rate (CAGR) to INR 3.15 trillion (USD 48.37 billion). The Indian electronics manufacturing sector is expected to reach USD 300 billion (INR 22.5 lakh crore) by 2024-25. Furthermore, increased consumer electronics device usage and consumption are predicted to fuel semiconductor demand, boosting wafer processing and assembly equipment market revenues throughout the projection period.
  • A prominent trend in the wafer processing and assembly equipment industry is the growing demand for miniaturized wafers with higher device performance. Wafers, for example, are flattened down to final thicknesses of tens of micrometers. Most semiconductor wafers used in memory, CIS, and power applications are reduced to 100 µm-200 µm in thickness. In the case of memory devices, further thickness reduction is required due to the need to maximize the memory capacity of single packages, increased data transmission rates, and power consumption fueled mostly by mobile applications. Silicon wafers thicker than 200 µm are used in standard memory devices like 2D NAND/DRAM.
  • The government bodies in the different regions are planning to invest in the production of semiconductors, which may create an opportunity for the studied market to grow. For instance, in September 2021, Germany's economy ministry stated that the country is willing to invest EUR 3 billion in the EU's "Important Projects of Common European Interest" initiative, which is one of the EU's primary subsidy tools for stimulating investment and reducing import dependency. The money will be used by the German government to build new semiconductor manufacturing factories. This investment is primarily aimed at reducing dependency on imported semiconductors for future semiconductor needs. Government policies like this will significantly drive the studied market.
  • Wafers are subjected to mechanical loads induced by sawing, manual handling, liquid jets, transport systems, and pick and place equipment during the wafer manufacturing cycle. Power semiconductors on the market now are generally made on 200-mm wafers with thicknesses ranging from 50 to 100 µm, although their roadmaps allow for wafers as thin as 1 µm. Mechanical polishing thins the backside of these wafers. Grinding marks, grinding failures resulting in edge chips, star cracks, and comets generated by edge particles caught in the grinding wheel, embedded particles, cleavage lines, and a variety of other faults are all defects caused by the polishing process.
  • Furthermore, the global shortage of wafer semiconductors led by the COVID-19 pandemic has encouraged players to focus on increasing production capacity. For instance, Semiconductor Manufacturing International Corp (SMIC) has indulged in aggressive plans to double its production capacity by 2025 by constructing new chip fabrication plants in different cities, including its announcement in September 2021 to establish a new factory in Shanghai's free trade zone.

Wafer Processing & Assembly Equipment Industry Overview

The Global Wafer Processing and Assembly Equipment market is moderately consolidated. Players tend to invest in innovating their product offerings to cater to the different industry's changing demands. Moreover, players adopt strategic activities like partnerships, mergers, and acquisitions to expand their presence. Some of the recent developments in the market are:

  • March 2022 - SK siltron announced the beginning of the operation of the Silicon carbide (SiC) semiconductor wafer manufacturing plant in Bay City, Michigan, US. The company has a plan to produce around 60,000 annually. Also, a 6-inch SiC wafer is the main product of the company.
  • September 2021 - Infineon Technologies AG launched its high-tech chip factory for power semiconductor devices on 300-millimeter thin wafers at its Villach site in Austria. At EUR 1.6 billion, the investment made by the company represents one of the largest such projects in the microelectronics sector in Europe. According to the company, the annual capacity planned for industrial semiconductors from the facility is sufficient to equip solar systems producing a total of around 1,500 TWh of electricity, which is around three times the annual power consumption of Germany.

Wafer Processing & Assembly Equipment Market Leaders

  1. Applied Materials Inc.

  2. ASML Holding Semiconductor Company

  3. Tokyo Electron Limited

  4. Lam Research Corporation

  5. KLA Corporation

  6. *Disclaimer: Major Players sorted in no particular order
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Wafer Processing & Assembly Equipment Market News

  • February 2022 - UK university research spin-out Intrinsic Semiconductor Technology's ReRAM that can be manufactured on the same CMOS wafers as microcontrollers, allowing for integrated SRAM-speed non-volatile memory without using separate NAND chips.
  • November 2021 - Texas Instruments Incorporated (TI) announced new 300-millimeter semiconductor wafer fabrication plants in Sherman, Texas. Because semiconductor development in electronics, particularly in the industrial and automotive applications, is likely to continue long into the future, the company's North Texas location has the potential for up to four fabs to meet demand over time. The first and second fabs are expected to be completed in 2022.

Wafer Processing & Assembly Equipment Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumption And Market Defination
  • 1.2 Scope of the study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power Of Suppliers
    • 4.2.2 Bargaining Power Of Buyers
    • 4.2.3 Threat Of New Entrants
    • 4.2.4 Threat Of Substitutes
    • 4.2.5 Intensity Of Competitive Rivalry
  • 4.3 Assessment of the Impact of Covid-19 on the Market

5. MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Needs of Consumer Electronic Devices Boosting the Manufacturing Prospects
    • 5.1.2 Proliferation of Artificial Intelligence, IoT and Connected Devices across Industry Verticals
  • 5.2 Market Challenges
    • 5.2.1 Dynamic Nature of Technologies Requires Several Changes in Manufacturing Equipment

6. MARKET SEGMENTATION

  • 6.1 By Equipment Type
    • 6.1.1 Chemical Mechanical Polishing (CMP)
    • 6.1.2 Etching
    • 6.1.3 Thin Film Deposition
    • 6.1.3.1 CVD
    • 6.1.3.2 Sputter
    • 6.1.3.3 Other Type
    • 6.1.4 Photoresist Processing
    • 6.1.5 Assembly Equipment
    • 6.1.5.1 Die Attach
    • 6.1.5.2 Wire Bonding
    • 6.1.5.3 Packaging
    • 6.1.5.4 Inspection, Dicing, Plating and Others
  • 6.2 By Geography
    • 6.2.1 Asia-Pacific
    • 6.2.2 North America
    • 6.2.3 Rest of the World
  • 6.3 By Product - Wafer Processing Equipment
    • 6.3.1 DRAM
    • 6.3.2 NAND
    • 6.3.3 Foundry/Logic
    • 6.3.4 Other Products

7. VENDOR RANKING ANALYSIS

8. COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 Applied Materials Inc
    • 8.1.2 ASML Holding Semiconductor Company
    • 8.1.3 Tokyo Electron Limited
    • 8.1.4 Lam Research Corporation
    • 8.1.5 KLA Corporation
    • 8.1.6 Hitachi High-Technologies Corporation
    • 8.1.7 Disco Corporation
    • 8.1.8 ASM Pacific Technology
    • 8.1.9 Kulicke and Soffa Industries, Inc
    • 8.1.10 BE Semiconductor Industries N.V
    • 8.1.11 Towa Corporation
  • *List Not Exhaustive

9. INVESTMENT ANALYSIS

10. FUTURE OF THE MARKET

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Wafer Processing & Assembly Equipment Industry Segmentation

Wafer processing equipment creates minute, multi-layer circuits on round silicon wafers primarily through physical and chemical methods. While various types of equipment are utilized to carry out these microscopic activities, most of these items can be divided into several groups. The Global Wafer Processing and Assembly Equipment Market is segmented by Equipment Type (Chemical Mechanical Polishing (CMP), Etching, Thin Film Deposition(CVD, Sputter), Photoresist Processing, Assembly Equipment (Die Attach, Wire Bonding, Packaging, Inspection, Dicing, Plating and Other), by Product (DRAM, NAND, Foundry/Logic) and Geography.

By Equipment Type Chemical Mechanical Polishing (CMP)
Etching
Thin Film Deposition CVD
Sputter
Other Type
Photoresist Processing
Assembly Equipment Die Attach
Wire Bonding
Packaging
Inspection, Dicing, Plating and Others
By Geography Asia-Pacific
North America
Rest of the World
By Product - Wafer Processing Equipment DRAM
NAND
Foundry/Logic
Other Products
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Wafer Processing & Assembly Equipment Market Research FAQs

What is the current Global Wafer Processing and Assembly Equipment Market size?

The Global Wafer Processing and Assembly Equipment Market is projected to register a CAGR of 8.4% during the forecast period (2025-2030)

Who are the key players in Global Wafer Processing and Assembly Equipment Market?

Applied Materials Inc., ASML Holding Semiconductor Company, Tokyo Electron Limited, Lam Research Corporation and KLA Corporation are the major companies operating in the Global Wafer Processing and Assembly Equipment Market.

Which is the fastest growing region in Global Wafer Processing and Assembly Equipment Market?

Asia-Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Global Wafer Processing and Assembly Equipment Market?

In 2025, the Asia-Pacific accounts for the largest market share in Global Wafer Processing and Assembly Equipment Market.

What years does this Global Wafer Processing and Assembly Equipment Market cover?

The report covers the Global Wafer Processing and Assembly Equipment Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Global Wafer Processing and Assembly Equipment Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Global Wafer Processing and Assembly Equipment Industry Report

Statistics for the 2025 Global Wafer Processing and Assembly Equipment market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Global Wafer Processing and Assembly Equipment analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.

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