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Embedded Die Packaging Market Size (2024 - 2029)

The embedded die packaging market is experiencing significant growth, driven by the increasing miniaturization of devices and the demand for improved electrical and thermal performance. This market expansion is fueled by advancements in micromachining and nanotechnology, which are essential for integrating more functionality into smaller products. The technology's superior performance in power management and telecommunications applications further enhances its appeal. However, challenges such as testing and inspection difficulties, particularly as features shrink, pose obstacles to market growth. The COVID-19 pandemic has also impacted the electronics supply chain, affecting production and distribution globally.

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Market Size of Embedded Die Packaging Industry

Embedded Die Packaging Market Size
Study Period 2019 - 2029
Base Year For Estimation 2023
CAGR 22.40 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Low

Major Players

Embedded Die Packaging Market Key Players

*Disclaimer: Major Players sorted in no particular order

Embedded Die Packaging Market Analysis

The embedded die packaging market was valued at USD 52.3 billion in 2020 and is expected to reach USD 175.27 billion by 2026 has been expected to grow at a CAGR of 22.4% during the forecast period (2021 - 2026). 3D packaging with embedded die solutions has become more attractive as an integration tool for next-generation devices which will become a key trend in future.

  • Growing miniaturization of devices is driving the market as products are becoming increasingly smaller and embed more functionality. Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today's high-density mobile devices.
  • Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies and redistribution layer (RDL) technology for electric car to improve the electric and thermal performance.
  • Further, owing to its excellent electrical performance at high frequencies, the technology is also being perceived as a promising technology for emerging telecommunication applications. Various advantages that aid the deployment of the technology in telecommunication applications include increased functionality and efficiency of the electronic circuits, power and signal inductance, improved reliability, and higher signal density.
  • Difficulty to test, inspect and rework, the embedded die technology challenges the market to grow. As features (lines and spaces) shrink to 2µm and below, it becomes more difficult to see defects. In addition, finding debris in via holes becomes a concern in some applications.
  • Since the outbreak of COVID-19, the electronics industry has been hit severely, with a significant influence on its supply chain and production facilities. The production came to a stand still in China and Taiwan during February and March, which influenced various OEMs across the world.

Embedded Die Packaging Industry Segmentation

Embedded die is described as a passive component or an IC (integrated circuit) that is placed or formed on an inner layer of an organic circuit board, module, or chip package. With increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies is driving the market growth.

Platform
Die in Rigid Board
Die in Flexible Board
IC Package Substrate
End User
Consumer Electronics
IT and Telecommunications
Automotive
Healthcare
Other End Users
Geography
Americas
Europe and MEA
Asia-Pacific
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Embedded Die Packaging Market Size Summary

The embedded die packaging market is experiencing significant growth, driven by the increasing miniaturization of devices and the demand for enhanced electrical and thermal performance. This technology is becoming a crucial integration tool for next-generation devices, particularly in sectors such as telecommunications, automotive, and consumer electronics. The market is characterized by the adoption of advanced materials and techniques, such as micromachining, nanotechnology, and flexible hybrid electronics, which enable the development of smaller, more efficient electronic components. These advancements are particularly beneficial in applications requiring high-frequency performance and improved reliability, such as in electric vehicles and high-density mobile devices. Despite challenges like testing and inspection difficulties, the market continues to expand, supported by innovations in semiconductor packaging and the increasing use of flexible printed circuit boards in wearable and IoT devices.

The United States plays a pivotal role in the embedded die packaging market, with significant investments and advancements in semiconductor technology. The country is home to numerous wafer fabrication plants and is at the forefront of packaging innovation, with companies like Intel leading the way in developing cost-effective, high-density interconnect solutions. The market is fragmented, with key players striving to maintain a competitive edge by focusing on emerging technologies such as 5G telecommunications and high-performance data centers. Recent developments, including government contracts and collaborations with major semiconductor companies, highlight the ongoing investment and interest in this sector. As the demand for compact and efficient electronic devices continues to rise, the embedded die packaging market is poised for further growth, driven by technological advancements and strategic partnerships.

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Embedded Die Packaging Market Size - Table of Contents

  1. 1. MARKET DYNAMICS

    1. 1.1 Market Overview

    2. 1.2 Market Drivers

      1. 1.2.1 Growing Miniaturization of Devices

      2. 1.2.2 Improved Electrical and Thermal Performance

    3. 1.3 Market Restraints

      1. 1.3.1 Difficulty to Inspect, Test and Rework

    4. 1.4 Industry Value Chain Analysis

    5. 1.5 Industry Attractiveness - Porter's Five Forces Analysis

      1. 1.5.1 Bargaining Power of Suppliers

      2. 1.5.2 Bargaining Power of Buyers/Consumers

      3. 1.5.3 Threat of New Entrants

      4. 1.5.4 Threat of Substitute Products

      5. 1.5.5 Intensity of Competitive Rivalry

    6. 1.6 Impact of COVID-19 on the Market

  2. 2. MARKET SEGMENTATION

    1. 2.1 Platform

      1. 2.1.1 Die in Rigid Board

      2. 2.1.2 Die in Flexible Board

      3. 2.1.3 IC Package Substrate

    2. 2.2 End User

      1. 2.2.1 Consumer Electronics

      2. 2.2.2 IT and Telecommunications

      3. 2.2.3 Automotive

      4. 2.2.4 Healthcare

      5. 2.2.5 Other End Users

    3. 2.3 Geography

      1. 2.3.1 Americas

      2. 2.3.2 Europe and MEA

      3. 2.3.3 Asia-Pacific

Embedded Die Packaging Market Size FAQs

The Embedded Die Packaging Market is projected to register a CAGR of 22.40% during the forecast period (2024-2029)

Microsemi Corporation, Fujikura Ltd., Infineon Technologies AG, ASE Group and AT&S Company are the major companies operating in the Embedded Die Packaging Market.

Embedded Die Packaging Report Snapshots

Embedded Die Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)