Market Share of Embedded Die Packaging Industry
The embedded die packaging market is fragmented due to the growing number of end-users in automotive, industrial, and consumer electronics. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies, such as 5G telecommunication, high-performance data centers, compact electronic devices, etc. Key players are Microsemi Corporation, Fujikura Ltd, etc. Recent developments in the market are -
- October 2020 - The U.S. Department of Defence awarded Intel Federal LLC the second phase of its Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the US government to access Intel's state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel's tens of billions of dollars of annual R&D and manufacturing investment. The project is executed by the Naval Surface Warfare Centre, Crane Division, and administered by the National Security Technology Accelerator.
- Sep 2019 - Achronix Semiconductor Corporation, a leading supplier in FPGA-based hardware accelerator devices and high-performance eFPGA IP, joined the TSMC IP Alliance Program, a key component of TSMC Open Innovation Platform (OIP). Achronix demonstrated how its Speedcore IP is uniquely sized and optimized for each customer's application in its booth at TSMC Open Innovation Platform Ecosystem Forum.
Embedded Die Packaging Market Leaders
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Microsemi Corporation
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Fujikura Ltd.
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Infineon Technologies AG
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ASE Group
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AT&S Company
*Disclaimer: Major Players sorted in no particular order
