How big is the Electronic Packaging Market?

The Electronic Packaging Market size is expected to reach USD 20.75 billion in 2024 and grow at a CAGR of 23.12% to reach USD 58.71 billion by 2029. Read More

What is the current Electronic Packaging Market size?

In 2024, the Electronic Packaging Market size is expected to reach USD 20.75 billion. Read More

Who are the key players in Electronic Packaging Market?

UFP Technologies, Inc., Sealed Air Corporation, DuPont de Nemours, Inc., SCHOTT AG and Sonoco Products Company are the major companies operating in the Electronic Packaging Market. Read More

Which is the fastest growing region in Electronic Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Electronic Packaging Market?

In 2024, the Asia Pacific accounts for the largest market share in Electronic Packaging Market. Read More

What years does this Electronic Packaging Market cover, and what was the market size in 2023?

In 2023, the Electronic Packaging Market size was estimated at USD 15.95 billion. The report covers the Electronic Packaging Market historical market size for years: . The report also forecasts the Electronic Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Electronic Packaging Market Share

Statistics for the 2023 & 2024 Electronic Packaging market share, created by Mordor Intelligence™ Industry Reports. Electronic Packaging share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Market Share of Electronic Packaging Industry

The electronics packaging market is fragmented. Microsystems are used in almost every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, and communications. The major market players include UFP Technologies, Schott AG, Sealed Air Corporation, DuPont de Nemours Inc., and Sonoco Products Company.

September 2023: Sealed Air collaborated with Sparck Technologies, a key 3D automated packaging solutions provider. Sealed Air is expected to exclusively distribute Sparck Technologies' 3D CVP automated packaging solutions in Australia, South Korea, Japan, and South Korea. As part of the alliance, Sealed Air's customers will benefit from access to the industry's most advanced automated packaging solutions, allowing them to streamline processes and create a more secure work environment.
November 2023: Mondi announced that it was leading the charge for sustainable alternatives by promoting corrugated packaging as a fully recyclable and compostable option. The company's corrugated boxes, made from recycled fibers, play a pivotal role in achieving Europe's notable 82.5% recycling rate for paper-based packaging. Committed to circular packaging for white goods and electronics, Mondi's experts in materials and designs are crafting advanced corrugated solutions as substitutes for EPS materials.
September 2023: Schott AG unveiled new microelectronic packages for the aerospace industry. The packages aim to extend the life of avionics protection while reducing the weight by up to 75% compared to conventional electronics packaging made from Kovar iron-nickel alloy. The products are also said to protect sensitive electronics, such as radio frequency designs, direct current/direct current converters (DC/DC), electrical storage devices, and sensor components.