Co-Packaged Optics Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Co-Packaged Optics Market Report is Segmented by Data Rates (Less Than 1. 6 T, 1. 6 T, 3. 2 T, and 6. 4 T) and by Geography (North America, Europe, Asia-Pacific, Latin America, and Middle East and Africa). The Market Sizes and Forecasts are Provided in Terms of Value (USD) for all the Above Segments.

Co-Packaged Optics Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Co-packaged Optics Market Size

Co-packaged Optics Market Summary
Study Period 2020 - 2030
Market Size (2025) USD 118.76 Million
Market Size (2030) USD 575.32 Million
CAGR (2025 - 2030) 37.10 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Low

Major Players

Co-packaged Optics Market Major Players

*Disclaimer: Major Players sorted in no particular order

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Co-packaged Optics Market Analysis

The Co-packaged Optics Market size is estimated at USD 118.76 million in 2025, and is expected to reach USD 575.32 million by 2030, at a CAGR of 37.10% during the forecast period (2025-2030).

Co-packaged optics, an innovative technology, integrates optical components directly into a switch ASIC package. This integration addresses the bandwidth and power challenges of the next generation. By merging optics and electronics, co-packaged optics tackles issues like bandwidth density, communication latency, and power efficiency in today's data-driven networks.

This technology combines silicon and optics on a single substrate, aiming to reduce energy use and latency. It also rethinks strategies, like near-compute in CMOS layouts, by positioning essential communication components closer together for better efficiency.

  • Current-generation global networks and data centers, fueled by demands from high-resolution video streaming, virtual reality, the Internet of Things (IoT), high-performance computing (HPC), and advancements in artificial intelligence and machine learning (AI/ML), grapple with soaring demands. These include the need for heightened bandwidth, diminished latency, and reduced power consumption. In response, the industry is channeling investments into co-packaged optics (CPOs), signaling a new era of solutions crafted for the demands of emerging applications and the future's high-capacity networks. Furthermore, numerous companies are investing and forging collaborations with various consortiums, amplifying the market's potential.
  • Broadcom highlights that co-packaged optics (CPO) represent a cutting-edge integration of optics and silicon on a unified substrate. This integration is pivotal in tackling the bandwidth and power challenges of the next generation. CPO synergizes expertise from fiber optics, digital signal processing (DSP), switch ASICs, and advanced packaging & testing. This collaboration promises significant value for data centers and cloud infrastructures. As investments in data centers surge and the demand for CPOs escalates, the market is poised for robust growth. 
  • Co-packaged optics (CPO) is poised to lead the way in communication, especially within the Silicon Photonics (SiPh) market. By shortening the electrical path, CPO conserves energy, minimizes heat generation, and boosts data transmission speeds. As silicon photonics evolves, numerous fabrication facilities and foundries are rolling out advanced passive and active devices, from modulators and photodetectors to lasers.
  • The inherent complexity of networking within and between data centers remains a significant barrier to the widespread adoption of co-packaged optics. While co-packaged optics deliver high-bandwidth, low-power interconnects at the chip level, scaling these benefits to a full network architecture is a considerable challenge. 
  • Recent events, including the surging demand for cryptocurrencies, trade barriers between the US and China, and escalating geopolitical tensions, have underscored the complexities of the industry's globalized supply chains, leading to production delays and shortages. This reliance on a limited number of players within the semiconductor supply chain introduces significant risks; even minor disruptions can yield extensive repercussions. Heightened geopolitical tensions are prompting nations to diversify their sourcing capabilities. Additionally, fluctuations in silicon prices, influenced by various trade scenarios, are anticipated to impact the market.

Co-packaged Optics Industry Overview

The Co-packaged optics market, dominated by major players like Ayar Labs Inc., Broadcom Inc., Cisco Systems Inc., IBM Corporation, Intel Corporation, and Microsoft Corporation, showcases a competitive landscape where firms vie for dominance through pricing, product offerings, and market share.

While major companies steer the market with their R&D and consolidation moves, the landscape is marked by deep market penetration and rising fragmentation. Innovation is the key to a sustainable competitive edge, with incumbents leaning on product differentiation and market expansion strategies.

Brand identity plays a pivotal role in the market dynamics. Established brands, synonymous with superior solutions, enjoy a competitive edge bolstered by their access to distribution channels, business relations, and innovative platforms.

Top players boasting of long-standing market credibility benefit from robust supplier-distribution ties and high market penetration. They're also zeroing in on lucrative industries, like hyperscalers, which present fresh applications for co-packaged optics.

These key market players wield significant influence, underscoring the heightened intensity of competitive rivalry.

Co-packaged Optics Market Leaders

  1. Ayar Labs Inc.

  2. Broadcom Inc.

  3. Cisco Systems Inc.

  4. IBM Corporation

  5. Intel Corporation

  6. *Disclaimer: Major Players sorted in no particular order
Co-packaged Optics Market Concentration
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Co-packaged Optics Market News

  • January 2025: NTT DOCOMO Ventures, Inc. invested in Ayar Labs, Inc. through its managed fund. The investment aims to propel advancements in optical I/O technologies, hasten the real-world application of innovative solutions, and cultivate new value in the sector. These technologies are pivotal for Co-Packaged Optics (CPO), which integrates optical communication directly into chip packages, servers, network devices, and other hardware. Leveraging these technologies, Ayar Labs enables data transmission via optical signals, both at the chip level and inter-chip.
  • December 2024: IBM unveiled an internal study detailing a co-packaged optics (CPO) prototype. This prototype harnesses polymer optical waveguides (PWG) to facilitate lightning-fast connectivity with data centers. IBM claims this technology can accelerate the training of artificial intelligence (AI) models by up to five times compared to traditional wiring while also slashing data center energy consumption by over 80%. This announcement marks a significant stride in the computing industry's ongoing endeavor to enhance data speeds within data centers and on circuit boards, especially as the processing needs of generative AI challenge the boundaries of Moore’s Law.

Co-packaged Optics Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumption and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of the Impact of Macro Economic Trends on the Industry
  • 4.5 Impact of Latency-Sensitive Traffic on Demand for CPO
    • 4.5.1 AI and Machine Learning in Data Centers
    • 4.5.2 5G, CPO, and the Impact on Data Centers
    • 4.5.3 Video Conferencing and Online Events

5. MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increase in Adoption of Smart Devices and Rise in Data Traffic
    • 5.1.2 Growth in the Importance of Mega Data Centers
    • 5.1.3 Growth in High-performance Computing
  • 5.2 Market Restraints
    • 5.2.1 Increase in Network Complexity
    • 5.2.2 Device Compatibility and Sustainability Issues

6. MARKET SEGMENTATION

  • 6.1 By Data Rates
    • 6.1.1 Less than 1.6 T
    • 6.1.2 1.6 T
    • 6.1.3 3.2 T
    • 6.1.4 6.4 T
  • 6.2 By Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia
    • 6.2.4 Australia and New Zealand
    • 6.2.5 Latin America
    • 6.2.6 Middle East and Africa

7. COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Ayar Labs Inc.
    • 7.1.2 Broadcom Inc.
    • 7.1.3 Cisco Systems Inc.
    • 7.1.4 IBM Corporation
    • 7.1.5 Intel Corporation
    • 7.1.6 Ranovus
    • 7.1.7 TE Connectivity
    • 7.1.8 Furukawa Electric Co. Ltd
    • 7.1.9 Hisense Broadband Multimedia Technology Co. Ltd
    • 7.1.10 POET Technologies
    • 7.1.11 Kyocera Corporation
    • 7.1.12 HiSilicon (Huawei Technologies Co. Ltd)
    • 7.1.13 SENKO Advanced Components Inc.
    • 7.1.14 Sumitomo Electric Industries Ltd
  • *List Not Exhaustive

8. INVESTMENT ANALYSIS

9. MARKET OPPORTUNITIES AND FUTURE TRENDS

**Subject to Availability
*** In the Final Report Asia, Australia and New Zealand will be Studied Together as 'Asia Pacific'
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Co-packaged Optics Industry Segmentation

The market is defined by the revenue generated through the sale of co-packaged optics offerings by various vendors operating in the market.

The co-packaged optics market is segmented by data rates (less than 1.6 T, 1.6 T, 3.2 T, and 6.4 T) and by geography (North America, Europe, Asia-Pacific, Latin America, and Middle East and Africa). The market sizes and forecasts are provided in terms of value (USD) for all the above segments.

By Data Rates Less than 1.6 T
1.6 T
3.2 T
6.4 T
By Geography North America
Europe
Asia
Australia and New Zealand
Latin America
Middle East and Africa
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Co-packaged Optics Market Research FAQs

How big is the Co-packaged Optics Market?

The Co-packaged Optics Market size is expected to reach USD 118.76 million in 2025 and grow at a CAGR of 37.10% to reach USD 575.32 million by 2030.

What is the current Co-packaged Optics Market size?

In 2025, the Co-packaged Optics Market size is expected to reach USD 118.76 million.

Who are the key players in Co-packaged Optics Market?

Ayar Labs Inc., Broadcom Inc., Cisco Systems Inc., IBM Corporation and Intel Corporation are the major companies operating in the Co-packaged Optics Market.

Which is the fastest growing region in Co-packaged Optics Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Co-packaged Optics Market?

In 2025, the North America accounts for the largest market share in Co-packaged Optics Market.

What years does this Co-packaged Optics Market cover, and what was the market size in 2024?

In 2024, the Co-packaged Optics Market size was estimated at USD 74.70 million. The report covers the Co-packaged Optics Market historical market size for years: 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Co-packaged Optics Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Co-packaged Optics Industry Report

Statistics for the 2025 Co-packaged Optics market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Co-packaged Optics analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.

Co-packaged Optics Market Report Snapshots