Market Share of Chemical Mechanical Polishing (CMP) Pad Industry
The chemical mechanical polishing (CMP) pads market is very competitive. It is highly concentrated due to various large and small players. All the major players account for a significant market share and focus on expanding the global consumer base. Some significant players in the market are 3M Co, DuPont de Nemours Inc., Fujibo Holdings Inc., Pureon, and SK enpulse. Several companies are increasing their market share by forming collaborations, partnerships, and acquisitions and introducing new and innovative products to earn a competitive edge during the forecast period.
- In April 2024, SK Hynix was set to continue with its scheduled investments in Korea. The company is getting the Yongin Semiconductor Cluster site ready to construct production facilities, with an investment of JPY 120 trillion (USD 0.74 trillion). The first fab was expected to start construction in March 2025 and be completed by early 2027. A mini fab will also be constructed to test semiconductor materials, components, and equipment using 300 mm wafer processing equipment.
- In September 2023, SK enpulse divested its semiconductor basic materials business, with the wet chemical business purchased by the local semiconductor/display materials company Yaker Technology and the cleaning business acquired by the investment company Sunyang Shinjin. Earlier this year, SKC consolidated its semiconductor materials/parts businesses into SK enpulse to enhance its presence in high-value-added materials business areas for semiconductor front-end processes, such as chemical mechanical polishing (CMP) pads and blank masks.
Chemical Mechanical Polishing (CMP) Pad Market Leaders
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3M Co
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DuPont de Nemours, Inc.
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Fujibo Holdings Inc.
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Pureon
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SK enpulse
*Disclaimer: Major Players sorted in no particular order