Asia-Pacific Electronics Adhesives Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The market is segmented by Resin Type (Epoxy, Acrylics, Polyurethane, and Other Resin Types), Application (Conformal Coatings, Surface Mounting, Encapsulation, Wire Tacking, and Other Applications), and Geography (China, India, Japan, South Korea, ASEAN Countries, and Rest of Asia-Pacific).

APAC Electronics Adhesives Market Size

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Asia-Pacific Electronics Adhesives Market - Market Summary
Study Period 2019 - 2029
Base Year For Estimation 2023
Forecast Data Period 2024 - 2029
Historical Data Period 2019 - 2022
CAGR > 8.00 %
Market Concentration High

Major Players

Asia-Pacific Electronics Adhesives Market

*Disclaimer: Major Players sorted in no particular order

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APAC Electronics Adhesives Market Analysis

The Asia-Pacific electronics adhesives market is expected to grow at with a CAGR greater than 8% during the forecast period. One of the major factors driving the market is the growing technological advancements in manufacturing electronic adhesives. However, volatility of the raw material prices is hindering the growth of the market studied. 

  • Shift towards environment-friendly water based adhesives is expected to provide a major growth opportunity for the market studied.
  • China accounted for the highest share of the market and is likely to continue dominating the market during the forecast period.
  • Among the application areas, surface mounting is expected to dominate the market during the forecast period.

APAC Electronics Adhesives Market Trends

This section covers the major market trends shaping the APAC Electronics Adhesives Market according to our research experts:

Surface Mounting Application to Dominate the market share

  • Surface mounting, also known as chip bonding, accounts for the highest share of the Asia-Pacific electronics adhesives industry.
  •  The major types of adhesives used in this application include mostly one-component systems, made from acrylics, epoxies, or urethane acrylates, and can be either electrically or thermally conductive. 
  • These adhesives used have superior physical and chemical quality which helps them to have a long shelf life, a high wet strength, rapid curing, strength, and flexibility.
  • Hence, according to the above-mentioned reasons, surface mounting is likely to dominate the market studied during the forecast period.
Asia-Pacific Electronics Adhesives Market - Revenue Trend

China to Dominate the Market

  • China accounts for the highest share of the total Asia-Pacific electronics adhesives market currently and is the biggest market both in terms of consumption and production of the electronic adhesives.
  • The increasing urbanization, growing connectivity, combined with the usage of advanced technology in the manufacturing of automotive safety technologies and infotainment systems, is boosting the demand for printed circuit boards.This in turn is boosting the demand for electronic adhesives in the country.
  • Additionally, the investments in the electronic industry in the country have growing consistently over the past few years. This is also driving the growth of electronic adhesives market in the country.
  • Hence, owing tot he above-mentioned factors, China is expected to dominate the Asia-Pacific electronics adhesives market during the forecast period.
Asia-Pacific Electronics Adhesive Market

APAC Electronics Adhesives Industry Overview

The Asia-Pacific electronics adhesives market is moderately consolidated as the market of the market share is divided among a few players. Some of the key players in the market include Henkel AG & Co. KGaA, Dow,H.B. Fuller Company, 3M, and BASF SE among others.

APAC Electronics Adhesives Market Leaders

  1. Henkel AG & Co. KGaA

  2. Dow

  3. H.B. Fuller Company

  4. 3M

  5. BASF SE

*Disclaimer: Major Players sorted in no particular order

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APAC Electronics Adhesives Market Report - Table of Contents

  1. 1. INTRODUCTION

    1. 1.1 Study Assumptions

    2. 1.2 Scope of the Study

  2. 2. RESEARCH METHODOLOGY

  3. 3. EXECUTIVE SUMMARY

  4. 4. MARKET DYNAMICS

    1. 4.1 Drivers

      1. 4.1.1 Growing Technological Advancements in Manufacturing Electronic Adhesives

      2. 4.1.2 Other Drivers

    2. 4.2 Restraints

      1. 4.2.1 Volatility in Raw Material Prices

      2. 4.2.2 Regulations Related to the VOCs

      3. 4.2.3 Other Restraints

    3. 4.3 Industry Value-chain Analysis

    4. 4.4 Porter's Five Forces Analysis

      1. 4.4.1 Bargaining Power of Suppliers

      2. 4.4.2 Bargaining Power of Consumers

      3. 4.4.3 Threat of New Entrants

      4. 4.4.4 Threat of Substitute Products and Services

      5. 4.4.5 Degree of Competition

  5. 5. MARKET SEGMENTATION

    1. 5.1 Resin Type

      1. 5.1.1 Epoxy

      2. 5.1.2 Acrylics

      3. 5.1.3 Polyurethane

      4. 5.1.4 Other Resin Types

    2. 5.2 Application

      1. 5.2.1 Conformal Coatings

      2. 5.2.2 Surface Mounting

      3. 5.2.3 Encapsulation

      4. 5.2.4 Wire Tacking

      5. 5.2.5 Other Applications

    3. 5.3 Geography

      1. 5.3.1 Asia-Pacific

        1. 5.3.1.1 China

        2. 5.3.1.2 India

        3. 5.3.1.3 Japan

        4. 5.3.1.4 South Korea

        5. 5.3.1.5 ASEAN Countries

        6. 5.3.1.6 Rest of Asia-Pacific

  6. 6. COMPETITIVE LANDSCAPE

    1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements

    2. 6.2 Market Share/Ranking Analysis**

    3. 6.3 Strategies Adopted by Leading Players

    4. 6.4 Company Profiles

      1. 6.4.1 3M

      2. 6.4.2 Arkema

      3. 6.4.3 Ashland

      4. 6.4.4 AVERY DENNISON CORPORATION

      5. 6.4.5 BASF SE

      6. 6.4.6 Beardow Adams

      7. 6.4.7 CHEMENCE

      8. 6.4.8 Covestro AG

      9. 6.4.9 Dow

      10. 6.4.10 H.B. Fuller Company

      11. 6.4.11 Henkel AG & Co. KGaA

      12. 6.4.12 Huntsman International LLC.

      13. 6.4.13 Sika AG

      14. 6.4.14 Illinois Tool Works Inc.

    5. *List Not Exhaustive
  7. 7. MARKET OPPORTUNITIES AND FUTURE TRENDS

    1. 7.1 Shift Towards Environment-friendly Water-based Adhesives

**Subject to Availability
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APAC Electronics Adhesives Industry Segmentation

The Asia-Pacific electronics adhesives market report include: 

Resin Type
Epoxy
Acrylics
Polyurethane
Other Resin Types
Application
Conformal Coatings
Surface Mounting
Encapsulation
Wire Tacking
Other Applications
Geography
Asia-Pacific
China
India
Japan
South Korea
ASEAN Countries
Rest of Asia-Pacific
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APAC Electronics Adhesives Market Research FAQs

The Asia-Pacific Electronics Adhesives Market is projected to register a CAGR of greater than 8% during the forecast period (2024-2029)

Henkel AG & Co. KGaA , Dow, H.B. Fuller Company, 3M and BASF SE are the major companies operating in the Asia-Pacific Electronics Adhesives Market.

The report covers the Asia-Pacific Electronics Adhesives Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Asia-Pacific Electronics Adhesives Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029.

Asia-Pacific Electronics Adhesives Industry Report

Statistics for the 2024 Asia-Pacific Electronics Adhesives market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Asia-Pacific Electronics Adhesives analysis includes a market forecast outlook to 2029 and historical overview. Get a sample of this industry analysis as a free report PDF download.

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Asia-Pacific Electronics Adhesives Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)