Market Trends of APAC Die Attach Equipment Industry
This section covers the major market trends shaping the APAC Die Attach Equipment Market according to our research experts:
CIS is expected to witness significant growth
- CMOS image sensors have been offering camera functions in smartphones and other products, and as the scaling demand grows, the related manufacturing issues in the fab arise.
- The higher-bandwidth data performance progressed from 3G to 4G, and currently, to 5G, the demand for higher quality cameras has grown. This trend has propelled the CMOS image sensor stacking techniques based on the need for higher pixel counts and better resolution. Beyond these trends, the areas of biometric ID, 3D sensing, and enhanced human vision applications have augmented segment growth.
- Customer demand for bigger and better cameras results in more sensors with bigger die sizes. Besides pixel scaling, CMOS image sensors are undergoing other innovations like die stacking. Vendors in the market studied are also using different interconnect technologies, such as through-silicon vias (TSVs), hybrid bonding, and pixel-to-pixel for the same.
- In hybrid bonding, for instance, the dies are connected using copper-to-copper interconnects. For this, two wafers are processed in a fab. One is the logic wafer, while the other is the pixel array wafer. The two wafers are joined using a dielectric-to-dielectric bond, followed by a metal-to-metal connection.
- Hybrid bonding DBI technologies, Xperi'sproprietary technology, are being significantly used by Samsung towards CMOS image sensor fabrication for its phones. This technology for CMOS Image Sensors facilitates room temperature Cu-Cu permanent bonding, low-temperature annealing (around 300°C) & no external pressure bonding process (dielectric/metal).
- Prior to this, direct bond technology has thus played an enabling role in the realization of pixel scaling (backside illumination) BSI and stacked BSI with multiple generational variations led by Xperifor over 15 years.
Understand The Key Trends Shaping This Market
Download PDF
LED to dominate market share
- Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. The demand for die-attach equipment is increasing with an increasing LED penetration rate. The selection of suitable die-attach material for a particular chip structure and application depends on various considerations, which include the packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and sintered materials have all been used for LED die attach.
- SFE provides an Epoxy Adhesive bonding method where its LED Epoxy Die Bonder machine features an index time of 0.2 Sec /Cycle (90 Percent Rate of Operation) with a chip size of 250 * 250 standards, providing lead frame recognition through 2 Cameras. Its software function provides auto mount level & pick up level teaching functions.
- Further, conductive adhesives (mostly silver-filled epoxies) constitute the largest class of thermal die-attach materials (by unit number) for LEDs. They are compatible with existing back-end packaging equipment and provide an attractive cost/performance balance (typically up to 50 W/mK thermals with secondary reflow compatibility). As they stick to bare silicon, they are the most preferred material for dies without back-end metallization like GaN on silicon.
- Further, in the LED market, there are a lot of rival competitors, and ASM is one of the prominent players in this market; its LED Epoxy High speed die bonder AD830 dominates in the LED market. It is fast, reliable, and accurate with die placement accuracy of +/-1 mil and +/-3 degree, cycle time for a small chip like 10mil x 10mil is 180 ms, which is an equivalent UPH of 18,000. It is equipped with a Post bond inspection system that monitors the bonded unit at the pre-set placement range.
Get Analysis on Important Geographic Markets
Download PDF
