What is the current 3D TSV Devices Market size?

The 3D TSV Devices Market is projected to register a CAGR of 6.20% during the forecast period (2024-2029) Read More

Who are the key players in 3D TSV Devices Market?

Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung Group, Toshiba Corporation, Pure Storage Inc. and ASE Group are the major companies operating in the 3D TSV Devices Market. Read More

Which is the fastest growing region in 3D TSV Devices Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in 3D TSV Devices Market?

In 2024, the North America accounts for the largest market share in 3D TSV Devices Market. Read More

What years does this 3D TSV Devices Market cover?

The report covers the 3D TSV Devices Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the 3D TSV Devices Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

3D TSV Devices Market Trends

Statistics for the 2023 & 2024 3D TSV Devices market trends, created by Mordor Intelligence™ Industry Reports. 3D TSV Devices trend report includes a market forecast to 2029 and historical overview. Get a sample of this industry trends analysis as a free report PDF download.

Market Trends of 3D TSV Devices Industry

This section covers the major market trends shaping the 3D TSV Devices Market according to our research experts:

LED Packaging Will Have a Significant Market Share

The increasing use of light-emitting diodes (LED) in products has promoted the development of higher power, greater density, and lower-cost devices. The use of three-dimensional (3D) packaging through-silicon via (TSV) technology allows a high density of vertical interconnects, unlike 2D packaging.
TSV integrated circuit reduced connection lengths, and thus, smaller parasitic capacitance, inductance, and resistance are required where a combination of monolithic and multifunctional integration is done efficiently, which provides high-speed low-power interconnects.
The embedded design with thin silicon membranes at the bottom optimizes the thermal contact and therefore minimizes the thermal resistance. Through silicon via (TSV) provides the electrical contact to the surface-mounted devices and mirrored sidewalls increase the package reflectivity and improve the light efficiency.
The SUSS AltaSpray technology is capable of coating integration of 90° corners, KOH (Potassium Hydroxide) etched cavities, Through Silicon Via (TSV) ranging from a few microns to 600μm or more. The ability to produce conformal resist coatings on severe topography, such as TSV, makes them the ideal choice for wafer-level packaging in LED, which increases the market growth.

Understand The Key Trends Shaping This Market

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Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period

Asia-Pacific is the fastest-growing market as countries in the region, such as China, Japan, South Korea, Indonesia, Singapore, and Australia, have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV market.
Asia-Pacific is also one of the most active manufacturing hubs in the world. The rising popularity of smartphones and demand for new memory technologies have increased the growth of computationally intensive consumer electronics, thereby, creating a wide range of opportunities in this region. As silicon wafers are widely used to manufacture smartphones, the introduction of 5G technology is expected to boost the sales of 5G smartphones, which may grow the market in the telecommunication sector.
In April 2019, in Korea, a collective laser‐assisted bonding process for 3D TSV integration with NCP( nonconductive paste) is made, where several TSV dies can be stacked simultaneously to improve the productivity while maintaining the reliability of the solder joints through Laser‐assisted bonding (LAB) advanced technology. These solder joints may increase the growth in consumer and commercial segments, which may increase the growth of the market.