3D Sensing And Imaging Market Share

Market Share of 3D Sensing And Imaging Industry

The 3D sensing market is semi-consolidated with many regional and global players. Moreover, with increased innovations and sustainable products, many companies are expanding their overall market presence by securing new contracts and tapping new markets to maintain their position in the global market. Some of the key developments are:

• May 2024: Lumotive, a pioneer in optical semiconductor technology, and Hokuyo Automatic Co. Ltd, a global provider of sensors and automation, commercially introduced the YLM-10LX 3D lidar sensor. This product is primarily powered by Lumotive's Light Control Metasurface (LCM) optical beamforming technology that represents a major leap forward in terms of applying solid-state, programmable optics to transform 3D sensing throughout service robotics and industrial automation applications.
• February 2024: STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, launched an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection and Ranging) module with 2.3k resolution. It can be used in multiple applications, such as camera assist, virtual reality, 3D webcams, robotics, and smart buildings.

3D Sensing and Imaging Market Leaders

1. Infineon Technologies AG

2. Microchip Technology Inc.

3. Omnivision Technologies, Inc.

4. Qualcomm Inc

5. Sick AG

*Disclaimer: Major Players sorted in no particular order