ASE Technology Reports - Industry Research
Reports Featuring ASE Technology
Advanced Packaging Market
The Advanced Packaging Market size is estimated at USD 32.64 billion in 2024, and is expected to reach USD 45 billion by 2029, growing at a CAGR of 6.63% during the forecast period (2024-2029).
Advanced IC Substrates Market
The Advanced IC Substrates Market size is estimated at USD 18.11 billion in 2024, and is expected to reach USD 31.54 billion by 2029, growing at a CAGR of 11.73% during the forecast period (2024-2029).
High-end Semiconductor Packaging Market
The High-end Semiconductor Packaging Market size is estimated at USD 36.95 billion in 2024, and is expected to reach USD 85.91 billion by 2029, growing at a CAGR of 15.10% during the forecast period (2024-2029).
Organic Substrate Packaging Material Market
The organic substrate packaging material market is valued at USD 13.87 billion in the current year.
Semiconductor Packaging Market
The Semiconductor Packaging Market size is estimated at USD 47.22 billion in 2024, and is expected to reach USD 79.37 billion by 2029, growing at a CAGR of 10.95% during the forecast period (2024-2029).
Panel Level Packaging Market
The Panel Level Packaging Market size is estimated at USD 0.25 billion in 2024, and is expected to reach USD 1.38 billion by 2029, growing at a CAGR of 41.07% during the forecast period (2024-2029).
3D TSV Devices Market
The 3D TSV Devices Market registered a CAGR of 6.2% over the forecast period 2021 - 2026.
Memory Packaging Market
The Memory Packaging Market was valued at USD 23.61 billion in 2020 and is expected to reach a value of USD 32.43 billion by 2026, at a CAGR of 5.5%, over the forecast period (2021 - 2026).
3D TSV And 2.5D Market
The 3D TSV And 2.5D Market size is estimated at USD 46.06 billion in 2024, and is expected to reach USD 223.33 billion by 2029, growing at a CAGR of 30.10% during the forecast period (2024-2029).
Embedded Die Packaging Market
The embedded die packaging market was valued at USD 52.3 billion in 2020 and is expected to reach USD 175.27 billion by 2026 has been expected to grow at a CAGR of 22.4% during the forecast period (2021 - 2026).
System in Package Technology Market
The system in package technology market is expected to register a CAGR of 8% over the forecast period 2021 - 2026.
2.5D & 3D Semiconductor Packaging Market
The 2.5D & 3D Semiconductor Packaging Market size is estimated at USD 9.91 billion in 2024, and is expected to reach USD 18.28 billion by 2029, growing at a CAGR of 13.03% during the forecast period (2024-2029).
3D IC Packaging Market
The Global 3D IC Packaging Market is expected to register a CAGR of 16.8% during the forecast period (2022-2027).
Other Reports Covering ASE Technology
Semiconductors
- 2.5D & 3D Semiconductor Packaging Market
- 3D IC Packaging Market
- 3D TSV And 2.5D Market
- 3D TSV Devices Market
- Advanced IC Substrates Market
- Advanced Packaging Market
- APAC Semiconductor Device Market For Industrial Applications
- APAC Semiconductor Device Market For Processing Applications
- China Semiconductor Device Market
- Embedded Die Packaging Market
- Europe Semiconductor Device In Consumer Industry
- Fan Out Packaging Market
- Flip Chip Technology Market
- Global Semiconductor Device Market
- High-end Semiconductor Packaging Market
- Japan Semiconductor Device Market
- Japan Semiconductor Device Market For Industrial Applications
- Organic Substrate Packaging Material Market
- Panel Level Packaging Market
- Semiconductor Device Market In Communication Industry
- Semiconductor Device Market In Consumer Industry
- Semiconductor Packaging Market
- System in Package Technology Market
