Amkor Technology Reports - Industry Research
Reports Featuring Amkor Technology
OSAT Market
The OSAT Market size is estimated at USD 43.36 billion in 2024, and is expected to reach USD 71.21 billion by 2029, growing at a CAGR of 8.62% during the forecast period (2024-2029).
Advanced Packaging Market
The Advanced Packaging Market size is estimated at USD 32.64 billion in 2024, and is expected to reach USD 45 billion by 2029, growing at a CAGR of 6.63% during the forecast period (2024-2029).
Power Module Packaging Market
The Power Module Packaging Market size is estimated at USD 2.5 billion in 2024, and is expected to reach USD 3.98 billion by 2029, growing at a CAGR of 9.78% during the forecast period (2024-2029).
High-end Semiconductor Packaging Market
The High-end Semiconductor Packaging Market size is estimated at USD 36.95 billion in 2024, and is expected to reach USD 85.91 billion by 2029, growing at a CAGR of 15.10% during the forecast period (2024-2029).
Semiconductor Packaging Market
The Semiconductor Packaging Market size is estimated at USD 47.22 billion in 2024, and is expected to reach USD 79.37 billion by 2029, growing at a CAGR of 10.95% during the forecast period (2024-2029).
Fan Out Packaging Market
The Fan Out Packaging Market size is estimated at USD 2.94 billion in 2024, and is expected to reach USD 6.30 billion by 2029, growing at a CAGR of 16.5% during the forecast period (2024-2029).
Flip Chip Technology Market
The flip chip technology market is expected to register a CAGR of 5.91% over the forecast period.
Memory Packaging Market
The Memory Packaging Market was valued at USD 23.61 billion in 2020 and is expected to reach a value of USD 32.43 billion by 2026, at a CAGR of 5.5%, over the forecast period (2021 - 2026).
3D TSV And 2.5D Market
The 3D TSV And 2.5D Market size is estimated at USD 46.06 billion in 2024, and is expected to reach USD 223.33 billion by 2029, growing at a CAGR of 30.10% during the forecast period (2024-2029).
System in Package Technology Market
The system in package technology market is expected to register a CAGR of 8% over the forecast period 2021 - 2026.
2.5D & 3D Semiconductor Packaging Market
The 2.5D & 3D Semiconductor Packaging Market size is estimated at USD 9.91 billion in 2024, and is expected to reach USD 18.28 billion by 2029, growing at a CAGR of 13.03% during the forecast period (2024-2029).
3D IC Packaging Market
The Global 3D IC Packaging Market is expected to register a CAGR of 16.8% during the forecast period (2022-2027).
Pharmaceutical Blister Packaging Market
The pharmaceutical blister packaging market is estimated to register a CAGR of 5.62 from 2022 to 2027.
Automotive Power Module Packaging Market
The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 - 2026).
Other Reports Covering Amkor Technology
Semiconductors
- 2.5D & 3D Semiconductor Packaging Market
- 3D IC Packaging Market
- 3D TSV And 2.5D Market
- 3D TSV Devices Market
- Advanced Packaging Market
- Automotive Power Module Packaging Market
- Embedded Die Packaging Market
- Fan Out Packaging Market
- Flip Chip Technology Market
- High Density Packaging Market
- High-end Semiconductor Packaging Market
- Memory Packaging Market
- OSAT Market
- Power Module Packaging Market
- Semiconductor Industry
- Semiconductor Packaging Market
- System in Package Technology Market
